Samsung Display Co., Ltd.

Eun Jeagal

Dong-Min Kim

Ki-Hyun Cho

Jin-Ho Ju

Chul-Won Park

Jeong-Won Kim

Seung-Ki Kim

Hoon Jong Kang

Ji-Hyun Kim

Jeong-Min Park

Min Hyuck Kang

Jun Su Chun

Tae-Gyun Kim

Jae-Sung Kim

Jung-Soo Lee

Bong-Yeon Kim

Hyun-Joo Lee

Sung-Kyun Park

Jun-Hyuk Woo

Kwang-Woo Park

Joo-Kyoung Park

Won-Young Lee

A method of forming a metal pattern is disclosed. In the method, a metal layer is formed on a base substrate. A photoresist composition is coated on the metal layer to form a coating layer. The photoresist composition includes a binder resin, a photo-sensitizer and a mixed solvent including a first solvent, a second solvent having a higher volatility than the first solvent, and a third solvent having a higher volatility than the second solvent. The coating layer is exposed to light. The coating layer is partially removed to form a photoresist pattern. The metal layer is patterned by using the photoresist pattern as a mask.

Photoresist composition and method for forming a metal pattern

A photoresist composition, a method of forming a pattern, and a method of manufacturing a thin film transistor substrate, the composition including a solvent, a novolak resin, a diazide-based photo-sensitizer, an acryl compound represented by the following Chemical Formula 1: 

Photoresist composition, method of forming a pattern and method of manufacturing a thin film transistor substrate

A photoresist composition may include a novolac resin, a diazide-based photosensitive compound, a surfactant represented by Chemical Formula 1 below, and a solvent.  R1 and R2 may denote a hydrogen atom or an alkyl group, x may be 10-50, and y may be 10-50.

Photoresist composition and method of manufacturing thin film transistor substrate using the same

A method of forming a metal pattern is disclosed. In the method, a metal layer is formed on a base substrate. A photoresist composition is coated on the metal layer to form a coating layer. The photoresist composition includes a binder resin, a photo-sensitizer, a mercaptopropionic acid compound and a solvent. The coating layer is exposed to a light. The coating layer is partially removed to form a photoresist pattern. The metal layer is patterned by using the photoresist pattern as a mask.

Photoresist composition and method of forming a metal pattern using the same

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Hwaseong-si, South Korea

Eun Jeagal