Scp Global Technologies, Inc.

Eric T Hansen

Victor B Mimken

Thomas Wayne Ives

William Warren Becia

Randy Mark Hall

Martin C Bleck

Tom Krawzak

Wyland L Atkins

John J Rosato

Tamer Elsawy

M Rao Yalamanchili

Thomas Krawzak

Josh Butler

R Mark Hall

In a method for treating a semiconductor substrate, a single substrate is positioned in a single-substrate process chamber and subjected to wet etching, cleaning and/or drying steps. The single substrate may be exposed to etch or clean chemistry in the single-substrate processing chamber as turbulence is induced in the etch or clean chemistry to thin the boundary layer of fluid attached to the substrate. Megasonic energy and/or disturbances in the chamber surfaces may provide the turbulence for boundary layer thinning. According to another aspect of a method according to the present invention, megasonic energy may be directed into a region within the single-substrate process chamber to create a zone of boundary layer thinning across the substrate surface, and a single substrate may be translated through the zone during a rinsing or cleaning process within the chamber to optimize cleaning/rinsing performance within the zone.

Apparatus and method for single substrate processing

Described herein is a chemical injection system and method utilizing a chemical storage vessel coupled to a bulk source of chemical and proportioned to contain a volume of chemical useful for multiple applications for which the chemical is to be utilized. A dispense vessel proportioned to contain a volume of chemical useful for a single application is fluidly coupled to the chemical storage vessel. A controller controls operation of a system of valves and sensors, which operate to fill the chemical storage vessel, and to precisely dispense the volume required for a single application from the storage vessel into the dispense vessel and then ultimately into the vessel in which the chemical is needed.

Chemical Dispensing system and method

A multiple stage wet processing platform includes a sealable enclosure, at least two processing modules positioned within the enclosure, at least one of them including a housing having an opening and a door moveable into position covering the opening, at least two processing vessels within the housing, and an intra-module robot within the housing and including a wafer support member, the intra-module robot moveable to a first position in which the support is disposed in a first one of the processing vessels and a second position in which the support is disposed in a second one of the processing vessels. An inter-module robot is positioned within the enclosure and is moveable between a first position adjacent to a first one of the modules and a second position adjacent to a second one of the modules.

Multiple stage wet processing platform and method of use

An apparatus and method for performing multiple wet processing steps on objects placed within a sealed chamber. The apparatus include a sealable chamber, at least one processing tank within the chamber, and preferably also includes an intrachamber robot configured to move objects to be treated within the chamber. Preferred embodiments utilize at least two processing tanks within the chamber. During use of these exemplary embodiments, objects to be treated are placed within the sealed chamber and the chamber is sealed to create a sealed interior environment. The objects are immersed in a first treatment fluid which is in a first one of the tanks, and then carried by the intrachamber robot from the first to the second tank where there are immersed in a second treatment fluid in the second tank. The objects may be moved back and forth between the tanks as needed in order to complete the process being performed. After processing is complete, the chamber is unsealed and the objects are removed from the chamber. In a preferred method, processing fluids are drained from the tanks at some point prior to the unsealing of the chamber in order to substantially prevent passage of fumes to the outside environment or contaminants from the exterior environment.

Multiple stage wet processing chamber

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Boise, ID, United States of America

Eric T Hansen