Shipley Company LLC

Amp-akzo Corporation

Rohm & Haas Electronic Materials LLC

Eric C Huenger

Richard A Mayernik

Jill E Steeper

Robert S Forman

Stanley W Tarry

Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in chip scale packaging.

Plating method

An improved method of manufacturing electrolessly deposited copper is described. The copper deposits are useful in the manufacture of fully additive and partly additive plated-through hole, printed wiring boards. The copper is deposited from a bath containing a copper compound, a complexing agent for copper, a reducing agent for copper, a pH-adjusting agent and one or more addition agents. The improvement for producing highly stress resistant, copper deposits comprises controlling one or more plating bath parameters such as pH, complexing agents and sources of iron or chromium, so that the trace iron and/or chromium in the deposited copper is less than 2 mg/mole of copper.

Ductile copper

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Seaford, NY, United States of America

Eric C Huenger