Hewlett-packard Company

En-Den D Liu

Hua-Yu Liu

Michael M O'Toole

Mark S Chang

A method to compensate for the E-beam proximity effect which includes a post exposure, pre-development baking of the photoresist layer. The baking of the photoresist layer causes a migration of small, photo-active compound (PAC) molecules to increase the size of peripheral exposed areas so as to compensate for the exposure size variations caused by the proximity effect.

Method for compensating for the E-beam proximity effect

An improved photoetch technique is presented of the multilayer resist type wherein a thin top layer of resist and a thick planarizing layer are deposited on a substrate and the thin layer is exposed and developed to produce a patterned resist layer. The improvement involves dissolving a suitable dye in a layer between the thin top layer and the substrate. The dye is preferably selected to absorb light of the wavelengths used to expose the top layer but does not interfere with processing of the other layers.

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Mountain View, CA, United States of America

En-Den D Liu