Motorola Corporation

Ellen Lan

Jenn-Hwa Huang

Kurt W Eisenbeiser

Yang Wang

William J Ooms

Jerald A Hallmark

Daniel S Marshall

David J Anderson

An electrode structure for semiconductor devices includes first electrode material positioned in overlying relationship to the surface of a substrate so as to define a first side wall perpendicular thereto. A nonconductive side wall spacer is formed on the first side wall and defines a second side wall parallel to and spaced from the first side wall. Second electrode material is formed in overlying relationship to the substrate and on the second side wall so as to define a third side wall parallel to and spaced from the second side wall. The first and second electrode materials are connected as first and second electrodes in a common semiconductor device. Additional electrodes can be formed by forming electrode material on additional side walls.

Electrode structure for transistors, non-volatile memories and the like

A vertical FET is fabricated by etching through a contact layer into a drift layer on a compound semiconductor substrate to form a plurality of mesas, each mesa having an upper surface and each adjacent pair of mesas defining therebetween a trench with sidewalls and a bottom. A conductive layer is conformally deposited over the plurality of mesas and the trenches and anisotropically etched to form contacts on the sidewalls of the trenches and depositing source contacts on the upper surfaces of the mesas and a drain contact on a reverse side of the substrate.

Method of fabricating vertical FET with sidewall gate electrode

A multi-state non-volatile ferroelectric memory includes a field effect transistor having a gate insulator formed of ferroelectric material. The ferroelectric material is separated into regions of different characteristics, e.g. different thicknesses, different coercive field values, etc., so as to provide a plurality of different threshold voltages for the field effect transistor.

Non-volatile multistate memory cell using a ferroelectric gate fet

A variable conducting element (10) and method for programming a constant current or constant resistance provided at output terminals (24 and 26) of a ferroelectric transistor (12). The ferroelectric transistor (12) has portions of a ferroelectric material (32A) programmed having up-polarization states separated by domain walls (34) from portions of a ferroelectric material (32B) programmed having down-polarization states. The portion of the ferroelectric material (32A) programmed in the up-polarization state forms current conduction channels between a source region (23) and a drain region (25) of the ferroelectric transistor (12). The ferroelectric transistor (12) is programmed through a capacitor (14) to adjust the charge supplied to a control terminal (22) of the ferroelectric transistor (12).

Growing community of inventors

Chandler, AZ, United States of America

Ellen Lan