Tokyo Electron Limited

Eiichiro Okamoto

Yoshifumi Amano

Yuki Ito

Jiro Higashijima

Ryoji Ikebe

Jian Zhang

Kazuya Iwanaga

Disclosed is a measurement processing device including: a processing unit configured to control an imaging device to image a substrate, on which a processing film is removed from the peripheral edge portion, and an enclosure member that surrounds the substrate. A captured image obtained by the imaging device is processed to measure a cut width in which the processing film is absent in the peripheral edge portion of the substrate, and a gap width between a peripheral edge end of the substrate and the enclosure member.

Measurement processing device, substrate processing system, measurement jig, measurement processing method, and storage medium

A substrate liquid processing apparatus including: a substrate rotary-holding unit configured to rotate a substrate while holding the substrate; and a processing liquid supply unit configured to supply a processing liquid to a bottom surface of the substrate held by the substrate rotary-holding unit. The substrate rotary-holding unit includes: a base plate disposed spaced apart from the substrate below the substrate; a cover member supported by the base plate and disposed outside an outer periphery of the substrate; and a discharge port formed between the base plate and the cover member and configured to discharge an air stream occurring below the substrate. The support portion of the base plate and the cover member protrudes outwards from a top surface of the base plate to be connected to the cover member.

Substrate liquid processing apparatus, substrate liquid processing method and substrate processing apparatus

When a substrate W is processed, a ring-shaped protective wall is located above the substrate held by the substrate holding unit and extends in a circumferential direction of the substrate. A radial position of an external periphery of a lower end of the protective wall is the same as a radial position of an internal periphery of a peripheral portion of an upper surface of the substrate held by a substrate holding unit, or is located at a radial outside. A first gap is formed between the protective wall and an upper surface of the substrate, a second gap is formed between the protective wall and a wall that defines the upper opening of the cup, and when the interior space of the cup is exhausted, a gas present above the substrate is introduced through the first gap and the second gap into the interior space of the cup.

Substrate processing apparatus and substrate processing method

When a substrate W is processed, a cover member covers a peripheral portion of the upper surface of the substrate held by the substrate holding unit, and a central portion of the substrate located at an inner position than the peripheral portion in a radial direction is exposed without being covered by the cover member. A gap is formed between the lower surface of the cover member and the peripheral portion of the upper surface of the substrate held by the substrate holding unit. When the interior space of the cup is exhausted, a gas present above the interior space of the cup is introduced from a space enclosed by the internal peripheral surface of the cover member through the gap into the interior space of the cup.

Disclosed is a substrate processing system including a substrate processing apparatus that includes a nozzle configured to eject a processing liquid to a substrate. The system includes a jig sensor configured to detect whether a checking jig provided with a liquid receiving unit receiving the processing liquid ejected from the nozzle and configured to check an ejection state of the processing liquid from the nozzle is installed at a predetermined position of the substrate processing apparatus; and a controller configured to control the ejection of the processing liquid from the nozzle. When it is determined that the checking jig is installed at the predetermined position of the substrate processing apparatus based on detection of the jig sensor in a state where the ejection of the processing liquid from the nozzle is prohibited, the controller permits the ejection of the processing liquid from the nozzle.

Substrate processing system, method for controlling substrate processing system, and storage medium

A substrate liquid processing apparatus includes a cupconfigured to receive a processing liquid supplied onto a substrate. The cup includes a ring-shaped first exhaust spacein contact with a top openingA, and a ring-shaped second exhaust spacewhich is in contact with an exhaust portand is disposed adjacent to the first exhaust space, and the first exhaust space and the second exhaust space communicate with each other intermittently or continuously along an entire circumference thereof. Further, the cup has an inner wall that confines an inner periphery of the second exhaust space, and the inner wall includes a first wall portionserving as an upper part of the inner wall, and a second wall portion which serves as a lower part of the inner wall and is located at an inner position than the first wall portion in a radial direction.

Growing community of inventors

Kumamoto, Japan

Eiichiro Okamoto