Tokyo Ohka Kogyo Co., Ltd.

Eiichi Shimura

Tomoyuki Ando

Yasushi Washio

Shinji Kumada

Toshiaki Tachi

Aya Momozawa

A method of forming a resist pattern, including forming a resist composition using a resist film; exposing the resist film; and alkali-developing the exposed resist film to form a positive-tone resist pattern, wherein the resist composition includes a first resin component and a second resin component which satisfies a specific relationship DR&#x3c;DRand DR&#x3c;DR, wherein DRis the dissolution rate of the first resin component (P1) in an alkali developing solution, DRis the dissolution rate of the second resin component (P2) in an alkali developing solution, and DRis the dissolution rate of a mixed resin of the first resin component (P1) and the second resin component (P2).

Method of forming resist pattern, resist composition and method of producing the same

A method of forming a photosensitive resin layer including laminating a photosensitive resin layer including a chemically amplified positive-type photosensitive resin composition which includes an acid generator which generates an acid upon light exposure and generates an acid by heating on a metal surface having catalytic activity, a resin whose solubility in alkali increases under the action of an acid, and an organic solvent, on an catalytic activity-containing metal surface of a substrate; and heating the photosensitive resin layer, so that the solubility in alkali of the photosensitive resin layer increases as the layer becomes closer to an interface with the substrate.

Method for forming photosensitive resin layer, method for producing photoresist pattern, and method for producing plated molded article

A method for producing a thick film photoresist pattern including laminating a thick photoresist layer including a chemically amplified positive-type photoresist composition for thick film on a support; irradiating the thick photoresist layer; and developing the thick photoresist layer to obtain a thick film resist pattern; in which the composition includes an acid generator, a resin whose alkali solubility increases by the action of an acid, and an organic solvent having a boiling point of at least 150&#xb0; C. and a contact angle on a silicon substrate of no greater than 18&#xb0;, in an amount of at least 40% by mass with respect to total mass of the organic solvent.

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Kawasaki, Japan

Eiichi Shimura