Bruker Nano Gmbh

Svxr, Inc.

Edward R Ratner

David Lewis Adler

Andrew George Reid

Renjie Hu

The presently-disclosed technology enables real-time inspection of a multitude of subcomponents of a component in parallel. For example, the component may be a semiconductor package, and the subcomponents may include through-silicon vias. One embodiment relates to a method for inspecting multiple subcomponents of a component for defects, the method comprising, for each subcomponent undergoing defect detection: extracting a subcomponent image from image data of the component; computing a transformed feature vector from the subcomponent image; computing pairwise distances from the transformed feature vector to each transformed feature vector in a training set; determining a proximity metric using said pairwise distances; and comparing the proximity metric against a proximity threshold to detect a defect in the subcomponent. Another embodiment relates to a product manufactured using a disclosed method of inspecting multiple subcomponents of a component for defects. Other embodiments, aspects and features are also disclosed.

Method and apparatus for rapid inspection of subcomponents of manufactured component

The present disclosure provides methods and apparatus for rapidly classifying detected defects in subcomponents of a manufactured component or device. The defect classification may occur after defect detection or, because the classification may be sufficiently rapid to be performed in real-time, during defect detection, as part of the defect detection process. In an exemplary implementation, the presently-disclosed technology may be utilized to enable real-time classification of detected defects in multiple subcomponents of the component in parallel. The component may be, for example, a multi-chip package with silicon interposers, and the subcomponents may include, for example, through-silicon vias and solder joints. Defects in subcomponents of other types of components may be also be classified. One embodiment relates to a method of classifying detected defects in subcomponents of a manufactured component. Another embodiment relates to a product manufactured using a disclosed method of inspecting multiple subcomponents of a component for defects.

Method and apparatus for rapidly classifying defects in subcomponents of manufactured component

The presently-disclosed technology improves the resolution of an x-ray microscope so as to obtain super-resolution x-ray images having resolutions beyond the maximum normal resolution of the x-ray microscope. Furthermore, the disclosed technology provides for the rapid generation of the super-resolution x-ray images and so enables real-time super-resolution x-ray imaging for purposes of defect detection, for example. A method of super-resolution x-ray imaging using a super-resolving patch classifier is provided. In addition, a method of training the super-resolving patch classifier is disclosed. Other embodiments, aspects and features are also disclosed.

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Minneapolis, MN, United States of America

Edward R Ratner