Advanced Micro Devices Corporation

Spansion Llc.

Fasl LLC

Edward Franklin Runnion

Mark W Randolph

Yi He

Darlene G Hamilton

Zhizheng Liu

Ming-Huei Shieh

Edward Hsia

Gwyn Robert Jones

Sameer S Haddad

Binh Quang Le

Xuguang Alan Wang

Kulachet Tanpairoj

Ming-Sang Kwan

Sheung-Hee Park

Pauling Chen

Wing Leung

Eric M Ajimine

Mark T Ramsbey

Yu Nan Sun

Chi K Chang

Kuo-Tung Chang

Lee Edward Cleveland

Kazuhiro Kurihara

Tien-Chun Yang

Pau-Ling Chen

Wei Zheng

Ashot Melik-Martirosian

Amol Ramesh Joshi

Emmanuil Lingunis

Sung-Yong Chung

Gulzar Ahmed Kathawala

Shigekazu Yamada

Nga-Ching Wong

Sung-Chul Lee

Zengtao Liu

Yuji Mizuguchi

Yanxia (Emma) Lin

Xianmin Yi

Yanxiang Liu

Systems, methods, and devices that facilitate applying a predefined negative gate voltage to wordlines adjacent to a selected wordline associated with a memory cell selected during a read or verify operation to facilitate reducing adjacent wordline disturb are presented. A memory component can comprise an optimized operation component that can apply a predefined negative gate voltage to wordlines adjacent to a selected wordline associated with a memory cell selected for a read or verify operation, based at least in part on predefined operation criteria, to facilitate reducing adjacent wordline disturb in the selected memory cell to facilitate reducing a shift in the voltage threshold and maintain a desired operation window. The optimized operation component optionally can include an evaluator component that can facilitate determining whether a negative gate voltage applied to adjacent wordlines is to be adjusted to facilitate reducing adjacent wordline disturb below a predetermined threshold amount.

Applying negative gate voltage to wordlines adjacent to wordline associated with read or verify to reduce adjacent wordline disturb

Methods and systems for accurately programming or erasing one or more memory cells on a selected wordline of a memory device are provided. In one embodiment, the memory device comprises a memory array, a threshold voltage measuring component configured to measure a threshold voltage of each memory cell on the selected wordline of the memory array, and an average threshold voltage determining component configured to determine an average threshold voltage result uniquely associated with the selected wordline, based on the measured threshold voltages. The memory device is configured to program one or more of the memory cells to a predefined program level relative to the determined average threshold voltage, or to erase memory cells of the selected wordline to the determined average threshold voltage. The method is particularly useful for multi-level flash memory cells to reduce charge loss while improving data reliability and Vt distributions of the programmed element states.

Algorithm for charge loss reduction and Vt distribution improvement

Methods of erasing flash memory cells are provided that improve erase cycling speed and reliability. One embodiment comprises interactively applying a stepped or ramped drain voltage pattern to a drain of the memory cells and a pulsed gate voltage pattern to a gate of the memory cells for a predetermined number of gate pulses or until all the memory cells are erased. In another embodiment, an erase bias circuit is provided for erasing a sector of flash memory cells, the circuit comprising row and column decoders that selects wordline rows and columns of cells, respectively, a supply bias arrangement that provides source and drain supply voltages for the sector, and a patterned pulse bias arrangement configured to provide a pulsed gate voltage pattern to gates of the cells selected by the row decoder and a drain voltage pattern to the drains of the cells selected by the column decoder.

Cycling improvement using higher erase bias

A method of erasing a block of flash memory cells by applying a ramped gate erase voltage to the block of memory cells. When an erase verify of the block of memory cells indicates that erasure has not been successfully completed another erase voltage with a greater absolute value than the initial erase voltage can be applied to the block of memory cells until erasure is complete.

Ramp gate erase for dual bit flash memory

A method is provided for erasing a memory device including a number of memory cells, the memory cells including a substrate, a control gate, a charge storage element, a source region and a drain region. The method includes erasing a group of memory cells to lower a maximum threshold voltage of the group of memory cells below a first predetermined level. The group of memory cells is soft-programmed to raise a minimum threshold voltage of the group of memory cells above a second predetermined level. The group of memory cells is erased, following soft-programming, resulting in a reduced threshold voltage distribution associated with the group of memory cells.

Methods and systems for reducing the threshold voltage distribution following a memory cell erase

A technique for forming at least part of an array of a dual bit memory core is disclosed. Initially, a portion of a charge trapping dielectric layer is formed over a substrate and a resist is formed over the portion of the charge trapping dielectric layer. The resist is patterned and a pocket implant is performed at an angle to establish pocket implants within the substrate. A bitline implant is then performed to establish buried bitlines within the substrate. The patterned resist is then removed and the remainder of the charge trapping dielectric layer is formed. A wordline material is formed over the remainder of the charge trapping dielectric layer and patterned to form wordlines that overlie the bitlines. The pocket implants serve to mitigate, among other things, complementary bit disturb (CBD) that can result from semiconductor scaling. As such, semiconductor devices can be made smaller and increased packing densities can be achieved by virtue of the inventive concepts set forth herein.

Pocket implant for complementary bit disturb improvement and charging improvement of SONOS memory cell

A method for controlling gate voltage in a memory device is described. The method includes providing a circuit that is adapted to be coupled with the memory device. The circuit is for generating a reference voltage. The method further includes utilizing the reference voltage provided by the circuit to apply a voltage at a gate of the memory device. The voltage has a value corresponding to a temperature of the memory device. The method also includes retaining a proportional relationship between the reference voltage and the temperature of the memory device, regardless of the change in the temperature of the memory device. The reference voltage provides a substantially constant programming time for the memory device regardless of the temperature of the memory device.

Method to obtain temperature independent program threshold voltage distribution using temperature dependent voltage reference

The present invention is a method and system for erasing a nitride memory device. In one embodiment of the present invention, an isolated P-well is formed in a semiconductor substrate. A plurality of N-type impurity concentrations are formed in the isolated P-well and a nitride memory cell is fabricated between two of the N-type impurity concentrations. Finally, an electrical contact is coupled to the isolated P-well.

Method and system for erasing a nitride memory device

Methods of operating dual bit flash memory devices and correcting over-erased dual bit flash memory devices are provided. The present invention includes a corrective action that employs a negative gate to correct over-erased memory cells without substantially altering threshold voltage values or charge states for properly erased memory cells. The negative gate stress is performed as a block operation by applying a negative gate voltage to gates and connecting active regions and a substrate to ground.

Memory device and methods of using negative gate stress to correct over-erased memory cells

A method of programming a dual cell memory device having a first charge storing cell and a second charge storing cell. The method can include applying an initial program pulse to the memory device; comparing the threshold voltage of the memory device with a verify threshold voltage; and if the threshold voltage of the memory device is less than the verify threshold voltage, applying a second program pulse to the memory device during which at least one condition of the second program pulse is modified from the initial program pulse.

Method of controlling program threshold voltage distribution of a dual cell memory device

A method of detecting a charge stored on a charge storage region of a first dual bit dielectric memory cell within an array of dual bit dielectric memory cells comprises grounding a first bit line that forms a source junction with a channel region of the first memory cell. A high voltage is applied to a gate of the first memory cell and to a second bit line that is the next bit line to the right of the first bit line and separated from the first bit line only by the channel region. A third bit line, that is the next bit line to the right of the second bit line, is isolated such that its potential is effected only by its junctions with the a second channel region and a third channel region on opposing sides of the third bit line. A high voltage is applied to a pre-charge bit line that is to the right of the third bit line and current flow is detected at the second bit line to determine the programmed status of a source bit of the memory cell.

Pre-charge method for reading a non-volatile memory cell

A method of programming a dual cell memory device having a first charge storing cell and second charge storing cell. The first charge storing cell can be pre-read to determine if the first charge storing cell stores an amount of charge to increase a threshold voltage of the memory device over a specified threshold voltage. If not, the second charge storing cell can be programmed with a standard program pulse. If so, the second charge storing cell can be programed with a modified program pulse.

Method of programming a dual cell memory device

An array of non-volatile memory cells includes active columns of cells wherein a data pattern may be stored adjacent to damaged or inactive columns wherein data is not stored. A method of storing a data pattern and reproducing the data pattern within such an array comprises storing a charge within a selected plurality of the memory cells within the active column. The selected plurality of memory cells represents a portion of the data pattern. An inactive memory cell programming pattern is identified. The inactive memory cell programming pattern identifies all, or a selected plurality, of the memory cells in the inactive column in which a charge is to be stored for the purpose of periodically storing a charge in the memory cells first inactive column to prevent over erasure, during bulk erase, and leakage from the inactive cells to adjacent active cells. A charge is stored on the selected plurality of the memory cells in the first inactive column. The data pattern is reproduced reading each memory cell within the first active column.

Method for reading a non-volatile memory cell adjacent to an inactive region of a non-volatile memory cell array

A method of programming a memory unit having a plurality of dual cell core memory devices and at least one dual cell dynamic reference device. The memory unit is subjected to an erase configuration operation such that each cell of the core memory devices is in a blank state and such that a threshold voltage of the at least one dynamic reference device is less than a charged program level threshold voltage. Thereafter, the at least one dynamic reference and the core memory devices are programmed using a page programming routine.

Method of improving dynamic reference tracking for flash memory unit

Growing community of inventors

Santa Clara, CA, United States of America

Edward Franklin Runnion