Siemens Aktiengesellschaft

Infineon Technology Ag

Eberhard Kuehn

Hellmut Ahne

Recai Sezi

Michael Sebald

Rainer Leuschner

Siegfried Birkle

Eva Rissel

Horst Borndoerfer

Juergen Beck

Albert Hammerschmidt

Gertrud Falk

Erwin Schmidt

Roland Gestigkeit

Ernst Christian Richter

Sueleyman Kocman

Hans-Juergen Bestmann

Racai Sezi

A photoresist compound or composition achieves a uniform volume growth in a chemical expansion on a chemically expandable photomask during a method for structuring a layer of the photoresist compound. The photoresist composition comprises a film-forming polymer having molecular groups that can be converted into alkali-soluble groups through acid-catalyzed separation reactions, and reactive molecular groups that can react with an expansion component so as to form a chemical bond. In addition, the photoresist composition comprises a photoacid generator that releases an acid upon exposure with radiation from a suitable wavelength range, and a thermoacid generator that releases an acid when supplied with sufficient thermal energy.

Photoresist compound and method for structuring a photoresist layer

In a process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides, a bis-o-aminophenol or a bis-o-aminothiophenol is reacted with a dicarboxylic acid derivative with the following structure: ##STR1## where D=O, S, or NH, and where R* is the parent body of the dicarboxylic acid and at least one of the groups R.sup.1 through R.sup.5 is F or CF.sub.3.

Preparation of poly-o-hydroxyamides and poly o-mercaptoamides

In a method of synthesis of polybenzoxazole and polybenzothiazole precursors, a dicarboxylic acid or a dicarboxylaic acid ester is reacted with a bis-o-aminophenol or bis-o-aminothiophenol in a suitable solvent in the presence of an activating reagent having the following structure: ##STR1##

Synthesis of polybenzoxasole and polybenzothiazole precursors

In a process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides, a bis-o-aminophenol or a bis-o-aminothiophenol is reacted with a dicarboxylic acid derivative with the following structure:

Preparation of poly-O-hydroxyamides and poly O-mercaptoamides

The dicarboxylic acid derivatives according to the invention have the following structure ##STR1## wherein X denotes O, S, (CF.sub.2).sub.m, C(CF.sub.3).sub.2 or CF.sub.2 --CF(CF.sub.3) (m=1 to 10), and R stems from the following compounds: fluoro- or trifluoromethyl- and nitro- or cyanophenols, thiophenols or -aminobenzenes, 4-hydroxy-, 4-mercapto- or 4-aminocoumarins, N-hydroxysuccinimides or N-hydroxymaleimides, 2-hydroxy- or 2-mercaptobenzoxazoles or -benzothiazoles and 1-hydroxy- or 1-mercaptobenzotriazoles.

Dicarboxylic acid derivatives

Premixed polymers which can serve as base polymers for high-resolution resists are structured from 40 to 99 mole % of a tert. butyl ester of an unsaturated carboxylic acid and 1 to 60 mole % of an anhydride of an unsaturated carboxylic acid.

Mixed polymers

New mixed polymers which can serve as base polymers for high-resolution resists are structured from 40 to 99 mole % of a tert. butyl ester of an unsaturated carboxylic acid and 1 to 60 mole % of an anhydride of an unsaturated carboxylic acid.

Copolymers

A process for producing structures in the submicron range is characterized by the following steps:

Photostructuring process

To produce N-tertiary butoxycarbonyl-maleinimide, maleinimide is reacted in the presence of a heterocyclic nitrogen compound having at least one tertiary nitrogen atom (as a base) with a more or less equimolar quantity of di-tertiary butyl-dicarbonate in a suitable solvent at temperatures of up to about 80.degree. C.

Process for producing N-tertiary butoxycarbonyl-maleinimide

The invention provides photosensitive mixtures consisting of a polymer and a photoactive component which meet the requirements placed on photoresists. The polymer has carboxylic acid anhydride groups or phenolic hydroxyl groups and the photoactive component is an N-alkylated or N-arylated 1.4-dihydropyridine or a 1.4- dihydropyridine derivative of the following structure: ##STR1## where the R group is a (substituted) aryl group, which, in the ortho position to the bond with the dihydropyridine ring, carries a NO.sub.2 group; and R.sup.3 is alkyl, cyclohexyl or phenyl.

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Hemhofen, Germany

Eberhard Kuehn