Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Durron Andre Hutt

James T Murnane

Jeffrey Borcherdt Miller

Robert A Brady

George McClain

Christopher Alan Young

Kathleen McHugh

Brian T Cantrell

Jeffrey James Hendron

Kenneth Vavala

A method of manufacturing grooved polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of defects in the polishing layers are minimized.

Method of manufacturing grooved chemical mechanical polishing layers

A method of manufacturing polishing layers having a window for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers having an integral window are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.

Method of manufacturing chemical mechanical polishing layers having a window

A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.

Method of manufacturing chemical mechanical polishing layers

A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of density defects in the polishing layers is minimized.

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Wilmington, DE, United States of America

Durron Andre Hutt