Semes Co., Ltd.

Duk Hyun Son

Hyung Joon Kim

Sun Ho Ha

Je Ho Kim

Dong Mok Lee

Mun Gi Jung

Su Bin Jeon

Provided is an equipment front end module which can effectively control internal humidity by efficiently circulating an inert gas. The equipment front end module comprises: a module chamber; a side storage installed on a first surface of the module chamber and capable of storing a plurality of substrates therein; an inert gas supplier configured to supply an inert gas into the module chamber, a first exhaust line configured to connect the side storage and an exhaust device; and a flow rate controller installed in the first exhaust line. The inert gas passes through the side storage from the module chamber and flows along the first exhaust line, and the flow rate controller controls a flow rate of the inert gas passing through the side storage.

Equipment front end module, operating method thereof, and substrate processing apparatus including same

A plasma processing apparatus using a magnetic field includes a reaction chamber, a plasma generating device connected to the reaction chamber to generate plasma in the reaction chamber, a substrate support disposed in a lower portion in the reaction chamber to support a wafer to be etched by the plasma, and a magnetic module including a permanent magnet and an electromagnet disposed vertically above the reaction chamber and a DC power supply unit connected to the electromagnet to input power to the electromagnet.

Plasma processing apparatus and plasma control method using magnetic field

Provided are a substrate transporting apparatus capable of preventing an increase in temperature of a transporting robot by installing a cooling plate around the transporting robot, and a substrate treating system including the same. The substrate transporting apparatus includes a transporting unit for transporting a substrate; and a cooling plate for controlling a temperature of the transporting unit, wherein the cooling plate is spaced apart from a side surface of the transporting unit and installed as a side wall, or is installed in close contact with the side surface of the transporting unit.

Apparatus for transporting substrate and system for treating substrate with the apparatus

A substrate treating apparatus is provided. The substrate treating apparatus includes an atmospheric pressure transfer module provided with a first transfer robot having a first hand with a substrate placed thereon; a vacuum transfer module provided with a second transfer robot having a second hand with a substrate placed thereon; a load-lock chamber positioned between the atmospheric pressure transfer module and the vacuum transfer module, and having an inner space convertible between an atmospheric pressure and a vacuum atmosphere; a process chamber coupled to the vacuum transfer module and treating the substrate; and a ring carrier supported by the first transfer robot or the second transfer robot for a transfer of a ring member. The ring carrier comprises a plate having the ring member placed thereon and at least one leg protruding from a bottom surface of the plate and placed at the first hand or the second hand.

Transfer assembly and apparatus for treating a substrate with the transfer assembly

Disclosed is a ring carrier used for transferring a ring member. The ring carrier includes a body having a plate shape, and a guide part protruding from an upper surface of the body to face an inner periphery of the ring member, and an alignment hole used when the ring carrier is aligned is formed in the body to pass through the body.

Ring carrier and substrate treating system

An apparatus for treating a substrate includes a process chamber that treats the substrate, a buffer module that accommodates a ring member to be transported into the process chamber, and a load-lock chamber having an inner space. The buffer module includes a buffer chamber having a buffer space in which the ring member is accommodated, a support shelf that supports the ring member in the buffer space, and a drive member that moves the support shelf.

Apparatus for treating substrate

Provided are a substrate storage apparatus and a substrate processing apparatus using the substrate storage apparatus. The substrate storage apparatus includes a housing having a loading/unloading port for loading/unloading of a substrate and configured to provide a loading space for a loaded substrate, a separation membrane coupled to the housing to divide the loading space into a plurality of separation spaces isolated from each other, a gas supplier configured to supply a purge gas into the loading space to clean the substrate, a gas discharger configured to discharge the purge gas accommodated in the loading space, and a controller configured to control supply and discharge of the purge gas for each of the plurality of separation spaces.

Substrate storage apparatus and apparatus for processing substrate using the same

A substrate treatment apparatus includes a transport part to transport a transparent rectangular substrate, a substrate support part to support the substrate, light generators to irradiate two different lights onto the moving substrate, and sense the irradiated lights, and a controller to determine a posture of the substrate with reference to the sensed lights and control the transport part such that the substrate is seated on the substrate support part in a default posture that is preset. The controller determines the posture of the transparent rectangular substrate with respect to the default posture using a time difference between a time point at which a first light of the two different lights is not transmitted through an edge of the transparent rectangular substrate and a time point at which a second light of the two different lights is not transmitted through the edge of the transparent rectangular substrate.

Growing community of inventors

Chungcheongnam-do, South Korea

Duk Hyun Son