Ekc Technology Inc.

Douglas Holmes

Jerome Daviot

Wai Mun Lee

Robert J Small

Bakul P Patel

Chris Reid

Christopher Reid

Stanley Affrossman

A composition for the stripping of photoresist and the cleaning of residues from substrates, and for silicon oxide etch, comprising from about 0.01 percent by weight to about 10 percent by weight of one or more fluoride compounds, from about 10 percent by weight to about 95% by weight of a sulfoxide or sulfone solvent, and from about 20 percent by weight to about 50 percent by weight water. The composition may contain corrosion inhibitors, chelating agents, co-solvents, basic amine compounds, surfactants, acids and bases.

Compositions for cleaning organic and plasma etched residues for semiconductor devices

The present invention relates to dilute aqueous solutions containing phosphoric acid and methods for cleaning plasma etch residue from semiconductor substrates including such dilute aqueous solutions. The solution according to the invention may advantageous contain an alkaline compound, one or more other acid compounds, and/or a fluoride-containing compound and may optionally contain additional components such as organic solvents, chelating agents, amines, and/or surfactants.

Aqueous phosphoric acid compositions for cleaning semiconductor devices

A composition for removing resist, polymeric material and/or etching residue from a substrate comprising titanium or an alloy thereof, the composition comprising hydroxylamine or a derivative thereof and at least one compound having the general formula (I) wherein: Rand Rare each independently selected from H, OH, COH, halogen, C&#x2013;Calkyl, C&#x2013;Calkoxy or (CH)OH wherein n is 1, 2 or 3; and Ris selected from C&#x2013;Calkyl, or C&#x2013;Calkoxy

Inhibition of titanium corrosion

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Bridge of Weir, United Kingdom

Douglas Holmes