Kla Tencor Corporation

Kla Corporation

Kla-tencor Technologies Corporation

Kla-technologies Corporation

Kla-tencor Coporation

Doug Keith Masnaghetti

Rainer Knippelmeyer

Mark Armstrong McCord

Richard R Simmons

Mehran Nasser-Ghodsi

Rudy Flores Garcia

Scott Allen Young

Gabor D Toth

Grace Hsiu-Ling Chen

Alexander Jozef Gubbens

Niles MacDonald

David Trease

Rohit Bothra

A scanning electron microscopy system with improved image beam stability is disclosed. The system includes an electron beam source configured to generate an electron beam and a set of electron-optical elements to direct at least a portion of the electron beam onto a portion of the sample. The system includes an emittance analyzer assembly. The system includes a splitter element configured to direct at least a portion secondary electrons and/or backscattered electrons emitted by a surface of the sample to the emittance analyzer assembly. The emittance analyzer assembly is configured to image at least one of the secondary electrons and/or the backscattered electrons.

Method and system for charged particle microscopy with improved image beam stabilization and interrogation

A scanning electron microscopy system is disclosed. The system includes a multi-beam scanning electron microscopy (SEM) sub-system. The SEM sub-system includes a multi-beam electron source configured to form a plurality of electron beams, a sample stage configured to secure a sample, an electron-optical assembly to direct the electron beams onto a portion of the sample, and a detector assembly configured to simultaneously acquire multiple images of the surface of the sample. The system includes a controller configured to receive the images from the detector assembly, identify a best focus image of images by analyzing one or more image quality parameters of the images, and direct the multi-lens array to adjust a focus of one or more electron beams based on a focus of an electron beam corresponding with the identified best focus image.

Method and system for focus adjustment of a multi-beam scanning electron microscopy system

Multi-beam scanning electron microscope inspection systems are disclosed. A multi-beam scanning electron microscope inspection system may include an electron source and a beamlet control mechanism. The beamlet control mechanism may be configured to produce a plurality of beamlets utilizing electrons provided by the electron source and deliver one of the plurality of beamlets toward a target at a time instance. The multi-beam scanning electron microscope inspection system may also include a detector configured to produce an image of the target at least partially based on electrons backscattered out of the target.

Backscattered electrons (BSE) imaging using multi-beam tools

A scanning electron microscopy system is disclosed. The system includes a multi-beam scanning electron microscopy (SEM) sub-system. The SEM sub-system includes a multi-beam electron beam source configured to generate a plurality of electron beams, a sample stage configured to secure a sample, an electron-optical assembly, and a detector assembly configured to detect a plurality of electron signal beams emanating from the surface of the sample to form a plurality of images, each image associated with an electron beam of the plurality of electron beams. The system includes a controller configured to receive the images from the detector assembly, compare two or more of the images to identify common noise components present in the two or more images, and remove the identified common noise components from one or more images of the plurality of images.

Method and system for noise mitigation in a multi-beam scanning electron microscopy system

Multi-beam scanning electron microscope (SEM) inspection systems with dark field imaging capabilities are disclosed. An SEM inspection system may include an electron source and at least one optical device. The at least one optical device may be configured to produce a plurality of primary beamlets utilizing electrons provided by the electron source and deliver the plurality of primary beamlets toward a target. The apparatus may also include an array of detectors configured to receive a plurality of image beamlets emitted by the target in response to the plurality of primary beamlets and produce at least one dark field image of the target.

Multi-beam dark field imaging

A voltage-isolating passageway for providing high voltage isolation between a component maintained at high DC voltage and a component maintained at a substantially lower voltage is described. The voltage-isolating passageway incorporates a transverse magnetic field across its passageway, which reduces the potential energy of charged particles (e.g., electrons) passing through the passageway. The voltage-isolating passageway includes a passageway and at least two magnets. The passageway has two openings and the two magnets are positioned along opposite and exterior surfaces of the passageway wherein the first and second magnets impose a magnetic field in a transverse direction with respect to a lengthwise axis of the passageway. In one embodiment, each of the passageways have small diameters and transfer gases at small flow rates. A support structure secures the passageways and magnets in position relative to each other and a magnetic shield encases the components to prevent the magnetic field from affecting external components.

Transverse magnetic field voltage isolator

Growing community of inventors

San Jose, CA, United States of America

Doug Keith Masnaghetti