Praxair S.t. Technology, Inc.

Doris Kwok

Lei Liu

James Kent Knapp

The polishing slurry includes polishing particles having a mean particle diameter of less than about 5 &mgr;m. The slurry contains at least about 0.5 total weight percent oxidizer selected from at least one of the group consisting of HNO , Ni(NO ) , Al(NO ) , Mg(NO ) , Zn(NO ) and NH NO . A small but effective amount of a co-oxidizer selected from the group consisting of perbromates, perchlorates, periodates, persulfates, permanganates, ferric nitrate, cerium-containing salts, perbenzoic acids, nitrite compounds, perborate compounds, hypochlorite compounds, chlorite compounds and chloride compounds accelerates removal of substrates; and water forms the balance of the aqueous slurry.

Polishing slurry

The polishing slurry includes polishing particles having a mean particle diameter of less than about 5 &mgr;m. The slurry contains at least about 0.5 weight percent oxidizer selected from at least one of the group consisting of HNO,, Ni(NO,),, Al(NO,),, Mg(NO,),, Zn(NO,),and NH,NO,. A small but effective amount of a co-oxidizer selected from the group consisting of perbromates, perchlorates, periodates, persulfates, permanganates and ferric nitrate accelerates removal of substrates; and water forms the balance of the aqueous slurry.

A hybrid slurry mixture that polishes substrates' surfaces. The hybrid slurry includes, by weight percent, 1 to 30 primary polishing particles, 1 to 50 dispersed colloidal particles, 1 to 40 oxidizer and balance water. The primary polishing particles are metal compounds selected from the group consisting of oxides, nitrides, carbides and borides. The primary polishing particles have a particle size from about 0.1 to 2 &mgr;m mean diameter. The dispersed colloidal particles are at least one oxide selected from the group consisting of alumina and silica. The dispersed colloidal particles have a particle size from about 2 to 500 nm mean diameter.

Hybrid polishing slurry

The invention provides a mixture for polishing surfaces. The mixture includes polishing particles having an average size of less than 10 .mu.m and water. It also includes an accelerator for chemically attacking a surface and a starch for reducing vibration of polishing machines.

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Fishers, IN, United States of America

Doris Kwok