Samsung Electronics Co., Ltd.

Doohwan Park

Jinnam Kim

Hoonjoo Na

Rakhwan Kim

Kichul Park

KyoungWoo Lee

Anthony Dongick Lee

Juyoung Jung

Yoonsuk Kim

Sangcheol Na

Eunji Jung

A semiconductor device includes a substrate. A wiring layer is over the substrate. A first via structure directly contacts a lower portion of the wiring layer. A second via structure directly contacts an upper portion of the wiring layer. The first via structure generates first stress in the wiring layer. The second via structure generates second stress in the wiring layer. The second stress is of an opposite type to the first stress. The first stress and the second stress compensate for each other in the wiring layer.

Semiconductor device including via structure

Growing community of inventors

Yongin-si, South Korea

Doohwan Park