Samsung Electronics Co., Ltd.

International Business Machines Corporation

Infineon Technologies Ag

Dong Hee Yu

Haoren Zhuang

Oh-Jung Kwon

O Sung Kwon

Len Yuan Tsou

Jong-Ho Yang

Hyung-Rae Lee

Bong-Seok Seo

A method and apparatus are provided for adapting a semiconductor inter-field dose correction map from a first photolithography mask to a second photolithography mask using the same manufacturing stack and reactive ion etching processes, the method including: obtaining a first dose correction map for the first photolithography mask as a function of first chip or die identities; determining a first transformation matrix from the first chip or die identities of the first photolithography mask into an orthogonal coordinate system; determining a second transformation matrix from second chip or die identities of the second photolithography mask into the orthogonal coordinate system; and transforming the first dose correction map for the first photolithography mask into a second dose correction map for the second photolithography mask in correspondence with each of the first and second transformation matrices.

Semiconductor inter-field dose correction

A method of transistor formation using a capping layer in complimentary metal-oxide semiconductor (CMOS) structures is provided, the method including: depositing a conductive layer over an n-type field effect transistor (nFET) and over a p-type field effect transistor (pFET); depositing a capping layer directly over the conductive layer; etching the capping and conductive layers to form a capped gate conductor to gates of the nFET and pFET, respectively; ion-implanting the nFET transistor with a first dopant; and ion-implanting the pFET transistor with a second dopant, wherein ion-implanting a transistor substantially dopes its source and drain regions, but not its gate region.

Transistor formation using capping layer

Growing community of inventors

Whasung, South Korea

Dong Hee Yu