Carl Zeiss Smt Gmbh

Dirk Juergens

Michael Totzeck

Ulrich Loering

Ralf Mueller

Olaf Conradi

Christian Wald

Markus Deguenther

Johannes Ruoff

Thomas Korb

Vladimir Davydenko

Bernd Geh

Dirk Hellweg

Kerstin Hild

Jens Timo Neumann

Joerg Zimmermann

An optical system for a lithography machine includes: a main mirror element and a manipulator device for positioning and/or orienting said main mirror element. The optical system also includes an optically active surface for reflecting radiation. The optical system further includes an actuator matrix positioned between the main mirror element and the optically active surface. The actuator matrix is configured to deform the optically active surface to influence the reflective properties of the optically active surface. A gap is present between the actuator matrix and a front side of the main mirror element so that the actuator matrix is spaced apart from the main mirror element.

Optical system, and method

The disclosure provides an illumination system of a microlithographic projection device having an image plane, in which a mask can be arranged, and a first object plane, which is optically conjugate to the image plane. A first illumination optical unit illuminates the first object plane with first projection light so that the first projection light has a first illumination angle distribution in the image plane. A second illumination optical unit illuminates a second object plane, which is optically conjugate to the image plane, with second projection light so that the second projection light has a second illumination angle distribution differing from the first illumination angle distribution in the image plane. An optical integrator is arranged exclusively in the light path of the first projection light.

Illumination system of a microlithographic projection device and method for operating such a system

A method of operating a projection exposure tool for microlithography is provided. The projection exposure tool has a projection objective for imaging object structures on a mask into an image plane using electromagnetic radiation, during which imaging the electromagnetic radiation causes a change in optical properties of the projection objective. The method comprises the steps of: providing the layout of the object structures on the mask to be imaged and classifying the object structures according to their type of structure, calculating the change in the optical properties of the projection objective effected during the imaging process on the basis of the classification of the object structures, and using the projection exposure tool for imaging the object structures into the image plane, wherein the imaging behavior of the projection exposure tool is adjusted on the basis of the calculated change of the optical properties in order to at least partly compensate for the change of the optical properties of the projection objective caused by the electromagnetic radiation during the imaging process.

Method of operating a projection exposure tool for microlithography

A method of reducing image placement errors in a microlithographic projection exposure apparatus includes providing a mask, a light sensitive layer and a microlithographic projection exposure apparatus which images features of the mask onto the light sensitive surface using projection light. Subsequently, image placement errors associated with an image of the features formed on the light sensitive surface are determined either by simulation or metrologically. Then an input state of polarization of the projection light is changed to an elliptical output state of polarization which is selected such that the image placement errors are reduced.

Optical system of a microlithographic projection exposure apparatus and method of reducing image placement errors

A projection exposure method includes exposing an exposure area of a radiation sensitive substrate with at least one image of a pattern of a mask in a scanning operation. The scanning operation includes moving the mask relative to an effective object field of the projection objective and simultaneously moving the substrate relative to an effective image field of the projection objective in respective scanning directions. The projection exposure method also includes changing imaging properties of the projection objective actively during the scanning operation according to a given time profile to change dynamically at least one aberration of the projection objective between a beginning and an end of the scanning operation.

Projection exposure method, system and objective

A lithographic system includes a projection system for projecting an object field through a projection system's pupil onto an image field. The projection system includes an optical element located at the projection system's pupil. The projection system's pupil is manipulable with respect to normalized pupil heights by the optical element. Related processes are also disclosed.

Lithographic systems and processes of making and using same

A projection exposure method is disclosed which includes exposing an exposure area of a radiation-sensitive substrate, arranged in an image surface of a projection objective, with at least one image of a pattern of a mask arranged in an object surface of the projection objective in a scanning operation. The scanning operation includes moving the mask relative to an effective object field of the projection objective and simultaneously moving the substrate relative to an effective image field of the projection objective in respective scanning directions. The projection exposure method also includes changing imaging properties of the projection objective actively during the scanning operation according to a given time profile to change dynamically at least one aberration of the projection objective between a beginning and an end of the scanning operation. Changing at least one imaging property of the projection objective includes changing optical properties of a mirror arranged in the projection beam path optically close to a field surface by changing a surface profile of the reflective surface of the mirror in an optically used area.

Growing community of inventors

Lauchheim, Germany

Dirk Juergens