International Business Machines Corporation

Dennis A Canfield

Voya Rista Markovich

Edwin Lorimer Thomas

Perminder S Bindra

Jeffrey McKeveny

Robert E Ruane

Alfred Viehbeck

Stephen L Tisdale

Harry R Bickford

Arthur E Graham

A dielectric substrate is conditioned for subsequent electroless plating thereon by contacting with a catalytic metal salt and then with a reducing agent and with an electroless metal plating bath followed by contacting with a second catalytic metal salt. In addition, a dielectric substrate is conditioned for electroless plating thereon by obtaining a substrate of a dielectric material that contains metal particles therein and contacting with a catalytic metal salt.

Conditioning of a substrate for electroless plating thereon

A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.

Encapsulated circuitized power core alignment and lamination

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Montrose, PA, United States of America

Dennis A Canfield