Lam Research Corporation

University of California

Novellus Systems Incorporated

Dengliang Yang

Joon Hong Park

David Wingto Cheung

Haoquan Fang

Dan Zhang

Gnanamani Amburose

Eunsuk Ko

Ivelin A Angelov

Faisal Yaqoob

Kwame Eason

Helen H Zhu

Pilyeon Park

James Eugene Caron

Weiyi Luo

Wei Yi Luo

Paul Raymond Besser

Bart Jan Van Schravendijk

George Matamis

Andrew C Kummel

Mark Naoshi Kawaguchi

Gerardo Delgadino

Ji Zhu

Joydeep Guha

William C Trogler

Yoshie Kimura

Ilia Kalinovski

Hsiao-Wei Chang

Brad Jacobs

Harald Orkorn-Schmidt

Thomas Gredig

Several designs of a gas distribution device for a substrate processing system are provided. The gas distribution device includes a dual plenum showerhead. Additionally, designs for a light blocking structure used with the showerheads are also provided.

Systems and methods for metastable activated radical selective strip and etch using dual plenum showerhead

A substrate processing system for selectively etching a substrate includes a first chamber and a second chamber. A first gas delivery system supplies an inert gas species to the first chamber. A plasma generating system generates plasma including ions and metastable species in the first chamber. A gas distribution device removes the ions from the plasma, blocks ultraviolet (UV) light generated by the plasma and delivers the metastable species to the second chamber. A substrate support is arranged below the gas distribution device to support the substrate. A second gas delivery system delivers a reactive gas species to one of the gas distribution device or a volume located below the gas distribution device. The metastable species transfer energy to the reactive gas species to selectively etch one exposed material of the substrate more than at least one other exposed material of the substrate.

A substrate processing system for selectively etching a layer on a substrate includes an upper chamber region, an inductive coil arranged around the upper chamber region and a lower chamber region including a substrate support to support a substrate. A gas distribution device is arranged between the upper chamber region and the lower chamber region and includes a plate with a plurality of holes. A cooling plenum cools the gas distribution device and a purge gas plenum directs purge gas into the lower chamber. A surface to volume ratio of the holes is greater than or equal to 4. A controller selectively supplies an etch gas mixture to the upper chamber and a purge gas to the purge gas plenum and strikes plasma in the upper chamber to selectively etch a layer of the substrate relative to at least one other exposed layer of the substrate.

Ultrahigh selective nitride etch to form FinFET devices

A method for selectively etching one exposed material of a substrate relative to another exposed material of the substrate includes a) arranging the substrate in a processing chamber; b) setting a chamber pressure; c) setting an RF frequency and an RF power for RF plasma; d) supplying a plasma gas mixture to the processing chamber; e) striking the RF plasma in the processing chamber in one of an electric mode (E-mode) and a magnetic mode (H-mode); and f) during plasma processing of the substrate, changing at least one of the chamber pressure, the RF frequency, the RF power and the plasma gas mixture to switch from the one of the E-mode and the H-mode to the other of the E-mode and the H-mode.

Systems and methods for selectively etching film

Provided are methods and apparatuses for removing a polysilicon layer on a wafer, where the wafer can include a nitride layer, a low-k dielectric layer, an oxide layer, and other films. A plasma of a hydrogen-based species and a fluorine-based species is generated in a remote plasma source, and the wafer is exposed to the plasma at a relatively low temperature to limit the formation of solid byproduct. In some implementations, the wafer is maintained at a temperature below about 60&#xb0; C. The polysilicon layer is removed at a very high etch rate, and the selectivity of polysilicon over the nitride layer and the oxide layer is very high. In some implementations, the wafer is supported on a wafer support having a plurality of thermal zones configured to define a plurality of different temperatures across the wafer.

Ultrahigh selective polysilicon etch with high throughput

A measurement system to measure a concentration of neutral gas species above a substrate includes a substrate support located in a chamber to support a substrate. A plasma source generates plasma in the chamber above the substrate. The plasma generates metastable species having higher ionization energy than a neutral gas species. The metastable species excite the neutral gas species located above the substrate. An optical emission spectrometer (OES) sensor measures spectra from a location above the substrate while the plasma is generated by the plasma source. A controller is configured to determine a concentration of the neutral gas species in a region above the substrate based on the measured spectra and to selectively process the substrate based on the concentration.

Systems and methods for detecting oxygen in-situ in a substrate area of a substrate processing system

A method for selectively etching a silicon nitride layer on a substrate includes arranging a substrate on a substrate support of a substrate processing chamber. The substrate processing chamber includes an upper chamber region, an inductive coil arranged outside of the upper chamber region, a lower chamber region including the substrate support and a gas dispersion device. The gas dispersion device includes a plurality of holes in fluid communication with the upper chamber region and the lower chamber region. The method includes supplying an etch gas mixture to the upper chamber region and striking inductively coupled plasma in the upper chamber region by supplying power to the inductive coil. The etch gas mixture etches silicon nitride, promotes silicon dioxide passivation and promotes polysilicon passivation. The method includes selectively etching the silicon nitride layer on the substrate and extinguishing the inductively coupled plasma after a predetermined period.

Systems and methods for ultrahigh selective nitride etch

A system is provided and includes a substrate processing chamber, one or more injectors, and a controller. The one or more injectors inject an electronegative gas, a baseline electropositive gas, and an additional electropositive gas into the substrate processing chamber. The electronegative gas includes an etch precursor. The additional electropositive gas mixes with and increases electron density of a plasma in the substrate processing chamber. The controller is configured to set an amount, flow rate or pressure of the additional electropositive gas based on at least one of a pressure of the electronegative gas or an electron affinity level of the additional electropositive gas.

System and method for increasing electron density levels in a plasma of a substrate processing system

A method for selectively etching a tungsten layer on a substrate includes arranging a substrate including a tungsten layer on a substrate support. The substrate processing chamber includes an upper chamber region, an inductive coil arranged outside of the upper chamber region, a lower chamber region including the substrate support and a gas dispersion device arranged between the upper and lower chamber regions. The gas dispersion device includes a plurality of holes in fluid communication with the upper and lower chamber regions. The method further includes controlling pressure in the substrate processing chamber in a range from 0.4 Torr to 10 Torr; supplying an etch gas mixture including fluorine-based gas to the upper chamber region; striking inductively coupled plasma in the upper chamber region by supplying power to the inductive coil; and selectively etching the tungsten layer relative to at least one other film material of the substrate.

Systems and methods for selectively etching tungsten in a downstream reactor

A method for processing a semiconductor substrate includes a) providing a substrate stack including a first layer, a plurality of cores arranged in a spaced relationship on the first layer and one or more underlying layers arranged below the first layer; b) depositing a conformal layer on the first layer and the plurality of cores; c) partially etching the conformal layer to create spacers arranged adjacent to sidewalls of the plurality of cores, wherein the partial etching of the conformal layer causes upper portions of the spacers to have an asymmetric profile; d) selectively etching the plurality of cores relative to the spacers and the first layer; e) depositing polymer film on sidewalls of the spacers; and f) etching the upper portions of the spacers to remove the asymmetric profile and to planarize the upper portions of the spacers.

Self-limited planarization of hardmask

A method for providing a FinFET device with an air gap spacer includes providing a substrate a plurality of fins and a dummy gate arranged transverse to the plurality of fins; depositing a sacrificial spacer around the dummy gate; depositing a first interlayer dielectric (ILD) layer around the sacrificial spacer; selectively etching the dummy polysilicon gate relative to the first ILD layer and the sacrificial spacer; depositing a replacement metal gate (RMG); etching a portion of the RMG to create a recess surrounded by the sacrificial spacer; and depositing a gate capping layer in the recess. The gate capping layer is at least partially surrounded by the sacrificial spacer and is made of silicon oxycarbide (SiOC).

Air gap spacer integration for improved fin device performance

An embodiment of the invention is an organic thin film transistor chemical sensor. The sensor includes a substrate. A gate electrode is isolated from drain and source electrodes by gate dielectric. An organic ultra-thin semiconductor thin film is arranged with respect to the gate, source and drain electrodes to act as a conduction channel in response to appropriate gate, source and drain potentials. The organic ultra-thin film is permeable to a chemical analyte of interest and consists of one or a few atomic or molecular monolayers of material. An example sensor array system includes a plurality of sensors of the invention. In a preferred embodiment, a sensor chip having a plurality of sensors is mounted in a socket, for example by wire bonding. The socket provides thermal and electrical interference isolation for the sensor chip from associated sensing circuitry that is mounted on a common substrate, such as a PCB (printed circuit board). A method of operating an organic thin film transistor chemical sensor exposes the sensor to a suspected analyte. A low duty cycle voltage pulse train is applied to the gate electrode to reduce baseline drift while sensing for a conduction channel change.

Growing community of inventors

Union City, CA, United States of America

Dengliang Yang