Dynamet Technology, Inc.

Other

Kokusai Bti Corporation

David M Rowell

Stanley Abkowitz

Harold L Heussi

Stephen A Kraus

Harold P Ludwig

Gideon Drimer

Arie Glaser

Lawrence R Gero

A semiconductor wafer furnace process tube includes one or more gas delivery lines which wind around the circumference of the process tube in a non-product region near one end to preheat the gas in the lines. The winding section begins within the non-product region of the heater and terminates prior to the location of the first wafer within the process tube. From the termination of the winding section, the delivery lines continue axially directly to the opposite end of the tube. The length of the lines within the winding section is preselected to adequately preheat the gas in the lines before the lines pass the wafers. In this manner, the gas is able to absorb energy from the non-product region of the furnace with minimal or no cooling of the wafers in the product region of the furnace. Additionally, the lines are routed to absorb energy equally around the circumference of the process tube and not create a cold side within the tube. Also, the straight runs past the wafers are equally spaced around the circumference of the tube. In this way, any remaining effect of the gas lines on the tube are balanced.

Process tube with in-situ gas preheating

A fast, safe pyrogenic external torch assembly that provides pure steam for semiconductor processing in semiconductor processing furnaces includes a gas injection nozzle subassembly, a pulse heater subassembly and a compressed-air-cooled heat-exchanging jacket subassembly. The gas injection nozzle subassembly includes plural oxygen gas injection nozzles and a hydrogen gas injection nozzle that cooperate to provide a torch that is well-behaved over the practicable range of oxygen and hydrogen gas supply rates and ratios, that may be quickly ramped to any desired gas flow conditions and that is free from the possibility of unwanted explosion due to incomplete hydrogen gas consumption. The pulse heater subassembly includes one or more blackbodies and a radiant energy source that are cooperative to quickly and efficiently provide one or more hot spots at the industry safe-ignition temperature. The compressed-air-cooled heat-exchanging jacket subassembly includes a double-walled jacket member through which a low-velocity, high-temperature and high-mass stream of compressed air is moved. The assembly of the invention is readily integrable with existing semiconductor processing furnaces, and enables quick subassembly and assembly placement and replacement during installation and maintenance.

Fast, safe, pyrogenic external torch assembly

Impact resistant clad composite armor and method for forming such armor. The impact resistant clad composite armor includes a ceramic core, and a layer of metal surrounding the ceramic material and bonded to the ceramic core. The metal layer is formed by cold isostatically pressing powder metal surrounding the ceramic core to a high initial density followed by vacuum sintering. The composite armor may be hot isostatically pressed to densify the powder metal to approximately 99% full density.

Impact resistant clad composite armor and method for forming such armor

A titanium-based metal matrix microcomposite material. About 1% to about 25% by weight TiB.sub.2 is substantially uniformly incorporated in a titanium-based alloy matrix. The microcomposite material is formed by sintering at a temperature selected to preclude diffusion of TiB.sub.2 into the matrix. The microcomposite material may be used in a process for cladding a macrocomposite structure.

Growing community of inventors

Billerica, MA, United States of America

David M Rowell