Rohm and Haas Electronic Materials Cmp Holdings, Inc.

David Kolesar

Alan Saikin

Aaron Sarafinas

Robert L Post

George McClain

A method of making a polishing layer for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate is provided, comprising: providing a liquid prepolymer material; providing a plurality of hollow microspheres; exposing the plurality of hollow microspheres to a carbon dioxide atmosphere for an exposure period to form a plurality of treated hollow microspheres; combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture; allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin &#x2266;24 hours after the formation of the plurality of treated hollow microspheres; and, deriving at least one polishing layer from the cured material; wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate.

Method of manufacturing chemical mechanical polishing layers

A method of making a polishing layer for polishing a substrate is provided, comprising: providing a liquid prepolymer material; providing a plurality of hollow microspheres; exposing the plurality of hollow microspheres to a vacuum to form a plurality of exposed hollow microspheres; treating the plurality of exposed hollow microspheres with a carbon dioxide atmosphere to form a plurality of treated hollow microspheres; combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture; allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin &#x2266;24 hours after the formation of the plurality of treated hollow microspheres; and, deriving at least one polishing layer from the cured material; wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate.

The present invention provides an apparatus for forming a chemical mechanical polishing pad, comprising a tank with polymeric materials, a storage silo with microspheres and a curative storage tank with curing agents. The apparatus further provides a premix prep tank for forming a pre-mixture of the polymeric materials and the microspheres and a recirculation loop in the premix prep tank for recirculating the pre-mixture until a desired bulk density is reached. The apparatus further provides a premix run tank for storing the pre-mixture, a mixer for forming a mixture of the pre-mixture and the curing agents and a mold for molding the mixture.

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Gulph Mills, PA, United States of America

David Kolesar