Motorola Corporation

David Haggart

Walter Glashauser

Katrin Ebner

Lutz Teichgr&auml;ber

A polishing head ( ) for a chemical-mechanical polishing machine that holds a semiconductor wafer ( ) against a polishing pad ( ) has a chuck ( ) with a pressure chamber ( ) to apply a down force substantially equally to the wafer backside ( ). An electrode arrangement ( ) within the chamber ( ) is located coplanar to the wafer ( ) to provide compensation to wafer or chuck irregularities by applying a compensation force having a distribution corresponding to the irregularities.

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Dresden, Germany

David Haggart