Applied Materials, Inc.

David H Loo

Cheng-Hsiung Matt Tsai

Shambhu Nath Roy

Puneet Bajaj

Richard J Green

Vineet Haresh Mehta

Karl M Brown

Bradley Owen Stimson

Kenny King-tai Ngan

Donny Young

Jr-Jyan Chen

Cheng-Hsiung (Matt) Tsai

Methods and apparatus for in-situ plasma cleaning of a deposition chamber are provided. In one embodiment a method for plasma cleaning a deposition chamber without breaking vacuum is provided. The method comprises positioning a substrate on a susceptor disposed in the chamber and circumscribed by an electrically floating deposition ring, depositing a metal film on the substrate and the deposition ring in the chamber, grounding the metal film deposited on the deposition ring without breaking vacuum, and removing contaminants from the chamber with a plasma formed in the chamber without resputtering the metal film on the grounded deposition ring and without breaking vacuum.

In situ plasma clean for removal of residue from pedestal surface without breaking vacuum

A high temperature cable includes wire bundle having a plurality of copper strands, where each copper strand has a barrier coating and an anti-oxidation coating disposed thereon. A mica-based layer is wrapped around a length of the wire bundle and a fiberglass layer is disposed over the mica-based layer.

High temperature DC chucking and RF biasing cable with high voltage isolation for biasable electrostatic chuck applications

A bipolar electrostatic chuck containing apparatus, and a concomitant method, for balancing an electrostatic force that the bipolar electrostatic chuck imparts upon a workpiece. More specifically, the bipolar electrostatic chuck contains a chuck body having a pair of electrodes embedded therein, a primary power supply and an offset power supply. Each electrode within the bipolar electrostatic chuck is respectively connected to a terminal on the primary power. Based upon a voltage produced by the primary power supply and a bias voltage of the workpiece, an offset voltage is applied by the offset power supply to one of the terminals, thus balancing the electrostatic force applied to the workpiece.

Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck

A method and apparatus which predicts an optimal period over which a dechucking voltage is applied to an electrostatic chuck to achieve dechucking of a workpiece therefrom. Specifically, the method is implemented as a software program that is executed by a conventional computer. The method applies an optimal dechucking voltage for an optimal dechucking period to dechuck the workpiece. To avoid charge accumulation on the electrostatic chuck when processing a succession of workpieces, the chucking and dechucking voltages reverse polarity after each workpiece is dechucked.

Method and apparatus for optimizing a dechucking period used to dechuck

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San Jose, CA, United States of America

David H Loo