Raytheon Company

US Government As Represented by the Secretary of the Army

Utah State University

David H Altman

Anurag Gupta

Boris Solomon Jacobson

Susan C Trulli

Steven D Bernstein

Scott R Cheyne

Jonathan Balducci

Erik F Nordhausen

Robert P Molfino

Steven B Wakefield

Nicholas Ian Maniscalco

Regan Andrew Zane

James A Pruett

Christopher R Koontz

Jason G Milne

Joseph R Ellsworth

Joshua D Sole

Craig H McCordic

Travis L Mayberry

Christian O Rodriguez

Shahed Reza

William J Davis

Darin J Sharar

Avram Bar-Cohen

Gregory P Schaefer

Philip M Henault

John G Bustamante

Joseph R Wasniewski

Charles P Scheffler

Michael E Null

Christopher H Peters

An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.

Shape memory thermal capacitor and methods for same

A system includes at least one component configured to generate thermal energy, a heat spreader configured to remove thermal energy from the at least one component, and at least one substrate configured to remove thermal energy from the heat spreader. The heat spreader includes a first portion and a second portion. The first portion of the heat spreader is coupled to the substrate, and the second portion of the heat spreader is coupled to the at least one component. The first portion of the heat spreader includes high aspect-ratio structures that are separated from one another. The high aspect-ratio structures cause the first portion of the heat spreader to be pliable and able to accommodate a mismatch in coefficients of thermal expansion between a material in the heat spreader and a material in the substrate.

Selectively-pliable chemical vapor deposition (CVD) diamond or other heat spreader

A computer-implemented method includes measuring, by a first local controller connected to a first converter, one or more characteristics of the first converter. The first converter belongs to a set of two or more converters in a power system configured to power equipment, and each of the two or more converters is connected to a respective local controller. An arc fault is detected based at least in part on the one or more characteristics of the first converter, and an indication of the arc fault is communicated to the central controller. The arc fault is remediated by performing one or more remedial operations determined by at least one of the first local controller and the central controller.

Arc flash protection of power systems

An adaptive stability control system includes a direct current (DC) bus and one or more distributed controllers. The DC bus is configured to provide bidirectional pulsed power flow and energy storage. The distributed controller is configured to continuously measure an impedance of the DC bus and execute at least one adaptive control algorithm to regulate impedance of the DC bus to maintain stability of the bidirectional pulsed power flow and energy storage.

Energy-based adaptive stability control system

A manifold structure has at least one flow passage and a center manifold section that has at least one machined cavity. The manifold structure includes a plurality of ultrasonically additively manufactured (UAM) finstock layers arranged in the flow passage. After the finstock is formed by UAM, the finstock is permanently joined to the center manifold section via a brazing or welding process. Using UAM and a permanent joining process enables joining of the UAM finstock having enhanced thermal features to a vacuum brazement structure. UAM enables the finstock to be formed of dissimilar metal materials or multi-material laminate materials. UAM also enables bond joints of the finstock to be arranged at angles greater than ten degrees relative to a horizontal axis by using the same aluminum material in the UAM process and in the vacuum brazing process.

Integration of ultrasonic additive manufactured thermal structures in brazements

A heat exchanger includes a housing configured to contain a working fluid. The heat exchanger also includes a plurality of chambers disposed within the housing and arranged so as to be surrounded by the working fluid when the working fluid is within the housing, each chamber configured to contain a phase change material (PCM) that expands upon freezing. The walls of each chamber are formed of a high thermal conductivity material that allows transfer of thermal energy between the working fluid and the PCM in each chamber. The walls of each chamber include expandable bellows configured to deform to increase an internal volume of the chamber as the PCM expands upon freezing.

Thermal storage heat exchanger structures employing phase change materials

A heat exchanger includes at least one conduit configured to carry a working fluid. The heat exchanger also includes a plurality of chambers in proximity to the at least one conduit, each chamber configured to contain a phase change material (PCM) that expands upon freezing. The at least one conduit and the plurality of chambers are thermally coupled for transfer of thermal energy between the working fluid and the PCM in each chamber. One wall of each chamber is formed of a compliant layer configured to deform to increase a volume of the chamber as the PCM expands upon freezing.

Methods and apparatus for a heat spreader including a vapor chamber, a fluid in the vapor chamber, a wick disposed in the vapor chamber, the wick comprising a metal wick structure, and a coating on wick comprising carbon nanotubes for promoting incipient boiling of the fluid.

Method and apparatus for heat spreaders having a vapor chamber with a wick structure to promote incipient boiling

A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.

Cold chassis for electronic modules and method of making same

A coolant distribution structure for an MMIC having: an input/output layer with an input port for receiving a coolant for transmission to coolant channels in the MMIC and an output port for exiting the coolant after such coolant has cooled active devices in the MMIC, a coolant pass-through layer to receive the coolant from the input port and having structure to inhibit such received coolant from passing directly to the output port, a coolant distribution layer for receiving coolant passing from the coolant pass-through layer and distributing such received coolant to the cooling channels to absorb heat generated by the active devices and then directing heated coolant to the coolant distribution layer and out of the porting layer via the pass-through layer. The coolant pass-through layer has a structure configured to inhibit such heated coolant from passing directly to the input port prior to such heated absorbed coolant being transmitted to the output port.

Coolant distribution structure for monolithic microwave integrated circuits (MMICs)

A monolithic microwave integrated circuit structure having: a semiconductor substrate structure having a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface of the substrate; a thermally conductive, electrically non-conductive heat sink; and a thermally conductive bonding layer for bonding the heat sink to the substrate, the thermally conductive bonding layer having an electrically conductive portion and an electrically non-conductive portion, the electrically conductive portion being disposed between the heat sink and an opposite surface of a portion of the substrate having the active devices and the electrically non-conductive portion being disposed on the opposite surface portion overlaying portion of the microwave transmission line section.

Patterned conductive epoxy heat-sink attachment in a monolithic microwave integrated circuit (MMIC)

A method for forming cooling channels in an interface for soldering to a semiconductor structure. The method includes: forming a metal seed layer on a surface of a substrate; patterning the metal seed layer into a patterned, plating seed layer covering portions of the substrate and exposing other portions of the substrate; using the patterned plating seed layer to form channels through the exposed portions of the substrate; and plating the patterned plating seed layer with solder. A heat exchanger having cooling channels therein is affixed to one surface of the interface and the semiconductor structure is soldered to an opposite surface of the interface. The cooling channels of the heat exchanger are aligned with the channels in the interface.

Method for creating a selective solder seal interface for an integrated circuit cooling system

A scalable method of edge cooling and making a cold chassis for electronic modules. The steps include fabrication of modular cooling ribs, each including microchannels along the cooling edge and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a chassis frame member. The rib flanges are sealed (e.g. friction stir welded) with respect to the frame member. The Application includes new and retrofit environments with increased cooling needs and multi-scaled manufacturing.

Method of making cold chassis for electronic modules

A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.

Nano-tube thermal interface structure

A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant flow under pressure through micro-channels for cooling heat loads on the cold plate system, first and second orifices disposed in the first flow path on an inlet side of the first flow path, and a third orifice spaced from a fourth orifice, the third and fourth orifices disposed in the second flow path on an inlet side of the second flow path, wherein the first and second orifices in the first flow path and the third and fourth orifices in the second flow path minimize a difference in mass flow rate between the first and second flow paths when the first and second flow paths are exposed to different heat loads.

Growing community of inventors

Framingham, MA, United States of America

David H Altman