Semitool, Inc.

Applied Materials, Inc.

Daniel L Durado

Raymon F Thompson

Robert W Gordon

Aleksander Owczarz

Thomas H Oberlitner

Ronald J Ray

Kyle Moran Hanson

Gregory J Wilson

Eric J Bergman

Paul R McHugh

John Lee Klocke

Richard W Plavidal

Jason A Rye

Deepak Saagar Kalaikadal

Benjamin Clay Bradley

Cameron H Law

Carl Campbell Stringer

Aaron Paul Juntunen

Cameron Law

James Jay Tripp

Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.

Electroplating wetting chamber with reduced bubble entrapment

Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

Plating systems having reduced air entrainment

A semiconductor processor including an enclosure with an access opening. A door assembly is supported for translational movement between aligned and displaced positions relative to the access opening. The door assembly has a main part, and an extension part which telescopically moves toward and away from the access opening. A bellows is provided between the main and extension parts. The closed door is sealed by a first face seal and a second expandable seal. A liquids trap is provided to prevent outward escape of liquids from the access opening. A drain removes liquid collected in the trap.

Semiconductor processor opening and closure construction

A door assembly for semiconductor processing equipment used to treat semiconductor substrates, wafers, photomasks, data disks, and other units. The door assembly is mounted to the front wall of a semiconductor processor enclosure having an access opening by means of a pair of guide rods and corresponding sliding bushings connected to the door which encircle the rods to allow movement of the door along the guide rods. A magnetic rodless piston mounted in an actuator bushing block which is magnetically coupled to an actuator bushing block moves the door assembly along the guide rods. The door assembly telescopically moves toward and away from the access opening to allow units to be installed into and removed from the enclosure, and to close the access opening. A window including an expandable seal is secured to an extension piece of the telescoping door assembly to seal between the door assembly and the access opening.

Door assembly for semiconductor processor

A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.

Method for single wafer processing in which a semiconductor wafer is

Single wafer processor

Growing community of inventors

Kalispell, MT, United States of America

Daniel L Durado