United Microelectronics Corp.

Other

United Silicon Incorporated

Daniel Chiu

Peng-Yih Peng

Juan-Yuan Wu

Kun-Lin Wu

Chien-Hsin Lai

Juen-Kuen Lin

Chih-Chiang Yang

Hao-Kuang Chiu

J Y Wu

Yu-Hao Chen

Kwo-An Chiang

J S Lai

C C Yang

A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Chemical-mechanical polish machines and fabrication process using the same

Chemical mechanical polish machines and fabrication process using the same

A method and an apparatus of uninterrupted slurry supply. A plurality of polishers are provided. A slurry supply system comprises a slurry supply source, a plurality of valve boxes having a corresponding number as the polishers, a plurality of pipes to connect the valve boxes and the slurry supply source and the valve boxes and the polishers, a plurality of bypasses to connect between an inlet and an outlet of each of the valve boxes, and a plurality elbow type manually controlled three-way valve at a plurality of joints of the pipes and the bypasses. A slurry is supplied from the slurry supply source. A flowing direction of the slurry is selected by adjusting the three-way valve to supply the polishers for polishing.

Method and apparatus of uninterrupted slurry supply

A retainer ring is provided for used on the polishing head of a CMP machine, which can allow the slurry being applied to the CMP process to be uniformly distributed over the surface of the wafer. The retainer ring is designed for use on a CMP machine of the type having a polishing table, a polishing pad, a polishing head for holding a semiconductor wafer retained in fixed position, and means for applying a mass of slurry to the wafer. The polishing head is of the type including an air-pressure means which can apply air pressure to a wafer loader used to hold the wafer in position. The retainer ring is formed with a plurality of straight grooves spaced at substantially equal intervals, each being radially inclined in such a manner so as to form an acute angle of attack against the slurry on the outside of said retainer ring when said retainer ring spins. Further, the retainer ring can be additionally formed with at least one circular groove intercrossing all of said straight grooves. The straight grooves can cause the slurry to be drawn into the inside of the retainer ring from all radial directions, thus allowing the slurry to be spread uniformly over the wafer.

Retainer ring for polishing head of chemical-mechanical polish machines

Growing community of inventors

Hsinchu Hsien, Taiwan

Daniel Chiu