Lam Research Corporation

Applied Materials, Inc.

Samsung Electronics Co., Ltd.

Dan Zhang

Gnanamani Amburose

David Wingto Cheung

Dengliang Yang

Haoquan Fang

Eunsuk Ko

Hung Chih Chen

Mark Naoshi Kawaguchi

Himanshu Chokshi

Chih-Hsun Hsu

Stephen Whitten

Shih-Chung Kon

Andrew Stratton Bravo

Weiyi Luo

Wei Yi Luo

Serge Kosche

Hui W Chen

Simon Yavelberg

Lakshmanan Karuppiah

Jim Kellogg Atkinson

Truong Nguyen

Jonathan Paul Domin

Noel Manto

Horng-Li Yeh

Charles Tang

A dual ion filter is arranged between upper and lower chambers of a substrate processing system. The dual ion filter includes upper and lower filters. The upper filter includes a first plurality of through holes configured to filter ions from a plasma in the upper chamber. The lower filter includes a second plurality of through holes configured to control plasma uniformity in the lower chamber. A diameter of the first plurality of through holes of the upper filter is less than a diameter of the second plurality of through holes of the lower filter. A number of the first plurality of through holes of the upper filter is greater than a number of the second plurality of through holes of the lower filter.

Substrate processing system including dual ion filter for downstream plasma

Several designs of a gas distribution device for a substrate processing system are provided. The gas distribution device includes a dual plenum showerhead. Additionally, designs for a light blocking structure used with the showerheads are also provided.

Systems and methods for metastable activated radical selective strip and etch using dual plenum showerhead

A substrate processing system includes an upper chamber and a gas delivery system to supply a gas mixture to the upper chamber. An RF generator generates plasma in the upper chamber. A lower chamber includes a substrate support. A dual ion filter is arranged between the upper chamber and the lower chamber. The dual ion filter includes an upper filter including a first plurality of through holes configured to filter ions. A lower filter includes a second plurality of through holes configured to control plasma uniformity.

A substrate processing system for selectively etching a substrate includes a first chamber and a second chamber. A first gas delivery system supplies an inert gas species to the first chamber. A plasma generating system generates plasma including ions and metastable species in the first chamber. A gas distribution device removes the ions from the plasma, blocks ultraviolet (UV) light generated by the plasma and delivers the metastable species to the second chamber. A substrate support is arranged below the gas distribution device to support the substrate. A second gas delivery system delivers a reactive gas species to one of the gas distribution device or a volume located below the gas distribution device. The metastable species transfer energy to the reactive gas species to selectively etch one exposed material of the substrate more than at least one other exposed material of the substrate.

An electronic system includes a control unit configured to generate a firmware register and store a system health information to the firmware register; and a communication unit, coupled to the control unit, configured to retrieve at least a portion of the system health information and communicate the portion of the system health information in response to a singular read request independent of an operational status of a host device.

Electronic system with health monitoring mechanism and method of operation thereof

Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

Roller assembly for a brush cleaning device in a cleaning module

A method and apparatus for providing uniform pressure, friction and/or contact between a substrate and a cylindrical roller in a brush-type cleaning system is described. The apparatus includes an alignment member adapted to allow pivotal movement of the cylindrical roller based on the topography of a substrate and/or the outer surface of the cylindrical roller. The method includes positioning a substrate between two cylindrical rollers, moving each of the two cylindrical rollers to a position where at least a portion of an outer surface of each of the cylindrical rollers are in contact with the major surfaces of the substrate, and rotating one or both of the substrate and the two cylindrical rollers relative to each other while allowing a longitudinal axis of one or both of the two cylindrical rollers to pivot relative to a plane defined by one of the major surfaces of the substrate.

Brush alignment control mechanism

Growing community of inventors

Fremont, CA, United States of America

Dan Zhang