Fujitsu Corporation

Kyushu Fujitsu Electronics Limited

Daitei Shin

Hideki Harada

Shun-ichi Fukuyama

Toshio Nomura

Yuki Komatsu

Masaaki Higasitani

Yoshihiro Nakata

Yoshiyuki Okura

Michiko Kobayashi

A process capable of forming an inorganic film which can be used at a relatively large thickness equivalent to, or greater than, the thickness of an organic SOG, without being subjected to oxidation by O.sub.2 plasma treatment used in a fabrication process of a semiconductor device. Polysilazane is first coated on a base, and the resulting polysilazane film is converted to a silicon dioxide film.

Process for forming silicon dioxide film

A thick planarization layer of silicon dioxide that is heat resistant is provided by coating a polysilazane layer over a substrate having steps and firing the polysilazane layer in an oxygen-containing atmosphere to convert the polysilazane to silicon dioxide. The temperature of this conversion may be as low as 400.degree. to 450.degree. C. while a higher firing or curing temperature is preferable to obtain a more densified oxide layer.

Process for fabricating an integrated circuit device by forming a

A dynamic random access memory comprises a memory cell region and a sense amplifier region defined on a substrate, a first insulation layer provided on the semiconductor substrate to cover both the memory cell region and the sense amplifier region, a first conductor pattern provided on the first insulation layer, an intermediate connection pattern provided on the first insulation layer in correspondence to the sense amplifier region, a spin-on-glass layer provided on the first insulation layer to extend over both the memory cell region and the sense amplifier region, and a projection part provided on the substrate of the sense amplifier region in correspondence to the intermediate connection pattern under the first insulation layer for lifting the level of the surface of the first insulation layer such that the intermediate interconnection pattern is exposed above the upper major surface of the spin-on-glass layer. Further, a second insulation layer is provided on the spin on glass layer to bury the first conductor pattern and the intermediate conductor pattern, and a contact hole is provided on the second insulation layer to expose the intermediate conductor pattern. The intermediate conductor pattern is connected electrically to a second conductor pattern provided on the second insulation layer via the contact hole.

Method of making dynamic random access memory having a reliable contact

A dynamic random access memory comprises a memory cell region and a sense amplifier region defined on a substrate, a plurality of memory cell capacitors provided on the memory cell region in correspondence to memory cell transistors, a first insulation layer provided on the semiconductor substrate to cover both the memory cell region and the sense amplifier region, a first conductor pattern provided on the first insulation layer, an intermediate connection pattern provided on the first insulation layer in correspondence to the sense amplifier region, a spin-on-glass layer provided on the first insulation layer to extend over both the memory cell region and the sense amplifier region, and a projection part provided on the substrate of the sense amplifier region in correspondence to the intermediate connection pattern under the first insulation layer for lifting the level of the surface of the first insulation layer such that the intermediate interconnection pattern is exposed above the upper major surface of the spin-on-glass layer. The projection part includes a conductor piece formed from a same conductor material that forms an opposing electrode of the memory cell capacitor. Further, a second insulation layer is provided on the spin on glass layer to bury the first conductor pattern and the intermediate conductor pattern, and a contact hole is provided on the second insulation layer to expose the intermediate conductor pattern. The intermediate conductor pattern is connected electrically to a second conductor pattern provided on the second insulation layer via the contact hole.

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Kawasaki, Japan

Daitei Shin