Nippon Soda Co., Ltd.

Asubio Pharma Co. Ltd.

Daisuke Asanuma

Tomoya Hidaka

Toshiaki Takahashi

Takahiro Sagae

Mitsuru Takase

Shigeo Mori

Hiroyuki Yazaki

The present invention is intended to provide an organosilicon compound for forming a novel organic thin film having improved physical properties. An organosilicon compound of the present invention is an organosilicon compound represented by formula (I) R&#x2014;(CH)&#x2014;SiX(I) (wherein R represents an alkoxy group having 1 to carbon atoms or a phenyl group that optionally has a substituent, X represents a hydroxyl group or a hydrolyzable group, and n represents any integer from 17 to 24). An organic thin film can be formed by mixing the aforementioned organosilicon compound, a compound that can interact with the organosilicon compound, and water in an organic solvent to prepare an organic thin film forming solution, and bringing the organic thin film forming solution into contact with a substrate.

Organosilicon compound, thin film forming composition using same, and organic thin film

The present invention is intended to provide an organosilicon compound for forming a novel organic thin film having improved physical properties. An organosilicon compound of the present invention is an organosilicon compound represented by formula (I) R&#x2014;(CH)&#x2014;SiX(I) (wherein R represents an alkoxy group having 1 to 3 carbon atoms or a phenyl group that optionally has a substituent, X represents a hydroxyl group or a hydrolyzable group, and n represents any integer from 17 to 24). An organic thin film can be formed by mixing the aforementioned organosilicon compound, a compound that can interact with the organosilicon compound, and water in an organic solvent to prepare an organic thin film forming solution, and bringing the organic thin film forming solution into contact with a substrate.

A solid material or an oily material for forming an organic thin film is produced by hydrolyzing and condensing at least one kind of organic metal compound expressed by Formula (1) in a lower alcohol-based solvent in the presence of water and an acid with a concentration of 0.5% to 5% by mass, or in a solvent that contains at least an aliphatic ether based or aliphatic ketone based solvent and an acid content of 0.1 to 20 moles acid per mole of the organic metal compound, in the resultant reaction solution. The solid material or oily material that is obtained is dissolved in an organic solvent, and a substrate is brought into contact with a solution that is obtained to form a highly functional organic thin film on the substrate. [Chemical Formula 1]RMX&#x2003;&#x2003;(I)

Process for producing organic thin film laminate using solid or oily material for organic thin film formation applications

The present invention provides a method for preparing an organic compound, which comprises a dehydration step of distilling off water from a polar organic solvent solution containing the organic compound and water to bring the concentration of water below a given level, wherein the dehydration step comprises distilling off water together with the polar organic solvent while adding a polar organic solvent to the solution, or comprises repeating several cycles of adding a polar organic solvent to the solution and then distilling off water together with the polar organic solvent. The present invention further provides the preparation of an organic compound, which enables efficient isolation of the target product in high isolated yield from a polar organic solvent solution containing the organic compound, water and, if necessary, a compound which produces, upon coming into contact with water or the like, a substance accelerating the decomposition of the organic compound.

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Niigata, Japan

Daisuke Asanuma