Tokyo Electron Limited

Dainippon Screen Mfg. Co., Ltd.

Daiki Kurihara

Takanori Hyakudomi

Takashi Miyake

Satoshi Sano

Hiromi Chaya

Disclosed is an inspection method capable of performing an inspection of high reliability even for very fine and thin-film electrode pads of a target object, by using needle traces formed on the electrode pads and making the electrode pads repeatedly contact the probes at high accuracy. In the inspection method, under the control of a control unitof an inspection apparatus, by using old needle traces formed on the respective pads P of the target object such as a semiconductor wafer W, contactable regions S for the probesA in preparation for a present inspection, so that each of the probesA contact each of the electrode pad P in the contactable region S and within an empty area with no needle trace.

Inspection method and program for inspecting electrical characteristics of a semiconductor wafer

In a prober, a post-contact image representing a region including a pad is acquired by capturing an image of a substrate after a probe has been brought into contact with the pad having an existing probe mark. An image storage unit stores in advance a pre-contact image representing the pad-inclusive region before the probe is brought into contact with the pad. A latest probe mark position acquiring unit acquires a position of a latest probe mark region created by the contact of the probe with the pad from among a plurality of probe mark regions in the post-contact image respectively corresponding to a plurality of probe marks on the pad by comparing the post-contact image with the pre-contact image. A positional deviation acquiring unit finds a deviation in a contact position of the probe with respect to the pad, based on the position of the latest probe mark region.

Probing apparatus and positional deviation acquiring method

An apparatus for fabricating a pre-press masking film used for correcting a color printing plate which is slightly tilted by a scanner based on an image edited by a layout system. The apparatus includes a coordinate data input unit for inputting coordinate data defining a trimming frame designated by the layout system, a tilt correcting unit for compensating for the tilt of the color printing plate by correcting the coordinate data, a unit for generating driving signals for forming a pre-press masking film based on the corrected coordinate data, and a cutter unit responsive to the driving signal for forming a pre-press masking film for cutting the masking film.

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Kyoto, Japan

Daiki Kurihara