Hewlett-packard Development Company, L.P.

Inpria Corporation

Craig M Gates

Benjamin L Clark

Dominick Smiddy

Mark Geniza

Mark C Huth

Alexey S Kabalnov

Jong-Souk Yeo

Mehrgan Khavari

Sean P McClelland

Joseph Burton Edson

Jeffrey Thomas Mergy

Niranjan Thirukkovalur

Peter De Schepper

Thomas J Lamkin

Wayne Alan Skankey

Jan Doise

Shu-Hao L Chang

Gaetano Giordano

Philip G Rourke

Michael "woody" Blackford

In the context of forming radiation patternable structures especially for EUV patterning, wafer structures are described comprising a substrate having a smooth top surface and a radiation sensitive organometallic coating having an average thickness of no more than 100 nm and no more than about 1 defect per square centimeter with a defect size of greater than 48 nm, evaluated with a 3 mm edge exclusion. Corresponding methods for forming a low defect coating comprise spin coating a purified radiation sensitive organometallic resist solution onto a wafer using a spin coater system comprising a delivery line and a delivery nozzle connected to the delivery line to form a coated wafer, and drying the coated wafer to form a radiation sensitive organometallic coating having no more than about 1 defect per square centimeter with a defect size of greater than 48 nm, evaluated with a 3 mm edge exclusion. Methods are provided for improved filtering for particle removal from radiation patternable organometallic resist compositions.

Organometallic radiation patternable coatings with low defectivity and corresponding methods

The purification of monoalkyl tin trialkoxides and monoalkyl tin triamides are described using fractional distillation and/or ultrafiltration. The purified compositions are useful as radiation sensitive patterning compositions or precursors thereof. The fractional distillation process has been found to be effective for the removal of metal impurities down to very low levels. The ultrafiltration processes have been found to be effective at removal of fine particulates. Commercially practical processing techniques are described.

Monoalkyl tin trialkoxides and/or monoalkyl tin triamides with particulate contamination and corresponding methods

Monoalkyl tin trialkoxides and/or monoalkyl tin triamides with low metal contamination and/or particulate contamination, and corresponding methods

The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.

Methods and systems for laser processing

A method of laser machining a substrate is provided. The method comprises directing laser energy at a first surface of the substrate, while providing an assist medium at the first surface of the substrate at least at approximately the area at which the laser energy is being directed. The assist medium is no longer provided prior to completion of formation of a feature in the substrate created utilizing the laser energy.

Laser micromachining methods and systems

A method for creating a mandrel for electroforming orifice sheets with tapered bores is described. The method uses photo-imagable polymer or photoresist to create the desired profile. This is followed by electroforming a parent mandrel over which a mandrel-quality sheet of glass is melted. An array of pillars with defined location and shape is formed with a desired profile for the mandrel to be used for the electroforming process. The glass is then metalized. A photoresist mask is formed on the metalized glass and a dielectric is deposited onto the pillars.

Re-usable mandrel for fabrication of ink-jet orifice plates

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Corvallis, OR, United States of America

Craig M Gates