Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Colin F Cameron, Jr

Joseph K So

Andrew Wank

Donna Marie Alden

Mark Gazze

Shawn Patrick Riley

Robert Gargione

David Drop

Mai Tieu Banh

The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 &#x3bc;m; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 &#x3bc;m.

Silicate composite polishing pad

Growing community of inventors

Delran, NJ, United States of America

Colin F Cameron, Jr