Nanonex Corporation

Accretech Usa, Inc.

Colby Steere

Stephen Y Chou

Hua Tan

Robert E Steere, Iii

Lin Hu

Linshu Kong

Mingtao (Gary) Li

Apparatus for double-sided imprint lithography of an apertured substrate comprises a pair of correspondingly apertured molds, a support for an assembly of the substrate and molds, and an alignment mechanism with radially movable elements for aligning the apertures of the molds and the substrate. The movable elements can be at least partially disposed in a spindle and can be removed radially outward by a conically tapered drive rod. Opposing surfaces of the substrate can then be imprinted in registration at the same time, preferably by fluid pressure imprint lithography.

Apparatus for double-sided imprint lithography

A wafer edge grinding or polishing machine is provided with a pair of chucks for engaging a wafer therebetween, a fixed reference surface and a sensor which is movable with a movable chuck. Measurements are made by the sensor relative to the fixed reference plane when the movable chuck is in engagement with the opposite chuck without a wafer therebetween in order to obtain a standard measurement value. With a wafer between the chucks, the sensor obtains an actual measurement value relative to the fixed reference surface. A calculator determines the difference between the standard and actual measurements values and displays the difference as the thickness of the wafer. Multiple sensors may be used to obtain multiples readings which are averaged by the calculator to obtain a thickness measurement.

Method for measuring wafer thickness

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Parsippany, NJ, United States of America

Colby Steere