Semiconductor Components Industries, LLC

Nexgen Power Systems, Inc.

Clifford Drowley

Subhash Srinivas Pidaparthi

Andrew P Edwards

Hao Cui

Ray Milano

Shahin Sharifzadeh

Robert Routh

Andrew J Walker

Wayne Chen

David DeMuynck

Joseph Tandingan

Francis Chai

Mark Curtice

Sharlene Wilson

Karthik Suresh Arulalan

Michael Craven

Kedar Patel

A vertical fin-based field effect transistor (FinFET) device includes an array of FinFETs comprising a plurality of rows and columns of separated fins. Each of the separated fins has a length and a width measured laterally with respect to the length and includes a first fin tip disposed at a first end of the separated fin, a second fin tip disposed at a second end of the separated fin opposing the first end, a central region disposed between the first fin tip and the second fin tip and characterized by a first electrical conductivity, and a source contact electrically coupled to the central region. The first fin tip and the second fin tip are characterized by a second electrical conductivity less than the first electrical conductivity. The FinFET further includes a first gate region surrounding the first fin tip and a second gate region surrounding the second fin tip.

Vertical fin-based field effect transistor (FinFET) with neutralized fin tips

A method of forming alignment marks, each alignment mark including a plurality of fiducials, includes providing a III-V compound substrate having a device region and an alignment mark region. The method also includes forming a first hardmask in the device region and a hardmask structure in the alignment mark region, etching a first surface portion of the III-V compound substrate to form a plurality of trenches in the device region, and epitaxially regrowing a semiconductor layer in the trenches. The method further includes forming a second mask in the device region and a patterned structure in the alignment mark region. The patterned structure includes a set of masked regions corresponding to the plurality of fiducials and a second set of openings. The method also includes forming the plurality of fiducials.

Method and system for fabricating fiducials for processing of semiconductor devices

A method of manufacturing a vertical FET device includes providing a semiconductor substrate structure including a marker layer; forming a hardmask layer coupled to the semiconductor substrate structure, wherein the hardmask layer comprises a set of openings operable to expose an upper surface portion of the semiconductor substrate structure; etching the upper surface portion of the semiconductor substrate structure to form a plurality of fins; etching at least a portion of the marker layer; detecting the etching of the at least a portion of the marker layer; epitaxially growing a semiconductor layer in recess regions disposed between adjacent fins of the plurality of fins; forming a source metal layer on each of the plurality of fins; and forming a gate metal layer coupled to the semiconductor layer.

Method and system for etch depth control in III-V semiconductor devices

Methods and semiconductor devices are provided. A vertical junction field effect transistor (JFET) includes a substrate, an active region having a plurality of semiconductor fins, a source metal layer on an upper surface of the fins, a source metal pad layer coupled to the semiconductor fins through the source metal layer, a gate region surrounding the semiconductor fins, and a body diode surrounding the gate region.

Fabrication method for JFET with implant isolation

A method of forming alignment marks includes providing a III-V compound substrate having a device region and an alignment mark region, forming a hardmask layer having a first set of openings on the alignment mark region exposing a first surface portion of the III-V compound substrate and a second set of openings on the device region exposing a second surface portion of the III-V compound substrate, etching the exposed surface of the III-V compound substrate using the hardmask layer as a mask to form a plurality of trenches, and epitaxially regrowing a semiconductor layer in the trenches to form the alignment marks extending to a predetermined height over the processing surface of the III-V compound substrate.

Method and system for fabricating fiducials using selective area growth

A vertical, fin-based field effect transistor (FinFET) device includes an array of individual FinFET cells. The array includes a plurality of rows and columns of separated fins. Each of the separated fins is in electrical communication with a source contact. The vertical FinFET device also includes one or more rows of first inactive fins disposed on a first set of sides of the array of individual FinFET cells, one or more columns of second inactive fins disposed on a second set of sides of the array of individual FinFET cells, and a gate region surrounding the individual FinFET cells of the array of individual FinFET cells, the first inactive fins, and the second inactive fins.

Methods and systems to improve uniformity in power FET arrays

A III-N-based vertical transistor includes a III-N substrate, a source, a drain, and a channel comprising a III-N crystal material and extending between the source and the drain. The channel includes at least one sidewall surface aligned ±0.3° with respect to an m-plane of the III-N crystal material. The III-N-based vertical transistor also includes a gate electrically coupled to the at least one sidewall surface of the channel.

Method and system for control of sidewall orientation in vertical gallium nitride field effect transistors

A method of clamping a voltage includes providing a fin-based field effect transistor (FinFET) device. The FinFET device includes an array of FinFETs. Each FinFET includes a source contact electrically coupled to a fin and a gate contact. The method also includes applying the voltage to the source contact and applying a second voltage to the gate contact. The voltage is greater than the second voltage. The method further includes increasing the voltage to a threshold voltage and conducting current from the source contact to the gate contact in response to the voltage reaching the threshold voltage.

Method and system for fin-based voltage clamp

A semiconductor device includes an active device region and a plurality of guard rings arranged in a first concentric pattern surrounding the active device region. The semiconductor device also includes a plurality of junctions arranged in a second concentric pattern surrounding the active device region. At least one of the plurality of junctions is arranged between two adjacent guard rings of the plurality of guard rings, and the plurality of junctions have a different resistivity than the plurality of guard rings. The semiconductor device further includes a plurality of coupling paths. At least one of the plurality of coupling paths is arranged to connect two adjacent guard rings of the plurality of guard rings.

Coupled guard rings for edge termination

A method of fabricating a vertical fin-based field effect transistor (FET) includes providing a semiconductor substrate having a first surface and a second surface, the semiconductor substrate having a first conductivity type, epitaxially growing a first semiconductor layer on the first surface of the semiconductor substrate, the first semiconductor layer having the first conductivity type and including a drift layer and a graded doping layer on the drift layer, and epitaxially growing a second semiconductor layer having the first conductivity type on the graded doping layer. The method also includes forming a metal compound layer on the second semiconductor layer, forming a patterned hard mask layer on the metal compound layer, and etching the metal compound layer and the second semiconductor layer using the patterned hard mask layer as a mask exposing a surface of the graded doping layer to form a plurality of fins surrounded by a trench.

Method and system for fabrication of a vertical fin-based field effect transistor

A method for manufacturing a semiconductor device includes: providing a semiconductor substrate; epitaxially growing a first semiconductor layer coupled to the semiconductor substrate; epitaxially growing a second semiconductor layer coupled to the first semiconductor layer, wherein the second semiconductor layer comprises a contact region and a terminal region surrounding the contact region; forming a mask layer on the second semiconductor layer, wherein the mask layer is patterned with a tapered region aligned with the terminal region of the second semiconductor layer; implanting ions into the terminal region of the second semiconductor layer using the mask layer to form a tapered junction termination element in the terminal region of the second semiconductor layer; and forming a contact structure in the contact region of the second semiconductor layer.

Method and system of junction termination extension in high voltage semiconductor devices

A method for manufacturing a vertical JFET includes providing a III-nitride substrate having a first conductivity type and forming a first III-nitride layer coupled to the III-nitride substrate. The first III-nitride layer is characterized by a first dopant concentration and the first conductivity type. The method also includes forming a plurality of trenches within the first III-nitride layer and epitaxially regrowing a second III-nitride structure in the trenches. The second III-nitride structure is characterized by a second conductivity type. The method further includes forming a plurality of III-nitride fins, each coupled to the first III-nitride layer, wherein the plurality of III-nitride fins are separated by one of a plurality of recess regions, and epitaxially regrowing a III-nitride gate layer in the recess regions. The III-nitride gate layer is coupled to the second III-nitride structure and the III-nitride gate layer is characterized by the second conductivity type.

Method of fabricating super-junction based vertical gallium nitride JFET and MOSFET power devices

A method for manufacturing a vertical FET device includes providing a semiconductor substrate structure including a semiconductor substrate and a first semiconductor layer coupled to the semiconductor substrate. The first semiconductor layer is characterized by a first conductivity type. The method also includes forming a plurality of semiconductor fins coupled to the first semiconductor layer. Each of the plurality of semiconductor fins is separated by one of a plurality of recess regions. The method further includes epitaxially regrowing a semiconductor gate layer including a surface region in the plurality of recess regions. The method also includes forming an isolation region within the surface region of the semiconductor gate layer. The isolation region surrounds each of the plurality of semiconductor fins. The method includes forming a source contact structure coupled to each of the plurality of semiconductor fins and forming a gate contact structure coupled to the semiconductor gate layer.

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Santa Clara, CA, United States of America

Clifford Drowley