Nihon Micro Coating Co., Ltd.

Mipox International Corporation

Claughton Miller

Ichiro Kodaka

Mitsuru Saito

Takuya Nagamine

Hisatomo Ohno

Toshihiro Izumi

Margarita Castillo

Charles Sischile

Alvin Timbang

A transparent pad having a polishing surface with an average surface roughness of 5 &#x3bc;m or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm&#x2013;900 nm.

Polishing pad and method of producing same

A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.

Layered support and method for laminating CMP pads

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Hayward, CA, United States of America

Claughton Miller