Yangtze Memory Technologies Co., Ltd.

Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

Chunyuan Hou

Qiang Tang

Ke Liang

Shuang Shuang Li

Yu Wang

Wei Huang

Yueping Li

Jiawei Chen

Khanh Nguyen

Weijun Wan

Liang Qiao

Jun Zhou

Li Xiang

Peng Sun

Qiong Zhan

Kaiwei Cao

Yi Gu

Shuang Li

Qing Ruan

Examples of the present application disclose a memory, a storage system and an electronic product. The memory comprises a control circuit, a voltage loading circuit, a first driver, and a second driver. The voltage loading circuit, in response to a block selection signal received by a control terminal, is configured to load a first voltage to a control terminal of the first driver through a first output terminal, and load a second voltage to a control terminal of the second driver through a second output terminal. Because starting voltages may be loaded by different output terminals, all the drivers do not share the same starting voltage any longer, and performance degradation caused by a tunneling effect is avoided. Therefore, based on the memory provided by the examples of the present application, the performance degradation of various drivers can be improved.

Memory with separate drivers for word lines and select gates

Semiconductor structure, comprising a memory-array unit comprising: a substrate, a memory array disposed on the substrate, and a first bonding region disposed around the memory array. The memory array comprises multiple word lines, multiple bit lines, and multiple source lines. The first bonding region comprises a first substrate-connecting bonding region, a first bit-line bonding region, a first word-line bonding region, and a first source-line bonding region. The first substrate-connecting bonding region is configured to connect the substrate electrically to a surface of the memory-array unit, the first bit-line bonding region is configured to connect the bit lines electrically to the surface of the memory-array unit, the first word-line bonding region is configured to connect the word lines electrically to the surface of the memory-array unit, and the first source-line bonding region is configured to connect the source lines electrically to the surface of the memory-array unit.

Three dimensional semiconductor memory structure

A memory device includes a first substrate, a first memory array, a second substrate, and at least one first vertical transistor. The first memory array is disposed on the first substrate. The first memory array includes at least one first word line structure. The first memory array is disposed between the first substrate and the second substrate in a vertical direction. The first vertical transistor is electrically connected with the first word line structure. At least a part of the at least one first vertical transistor is disposed in the second substrate.

Memory device

The present disclosure provides a three-dimensional NAND memory device, comprising a first NAND string including a first channel corresponding to a first cell to be inhibited to program, and a controller configured to control a word line driver and a bit line driver to do the following operations: prior to applying a program voltage to a selected word line, charging a first bit line electrically coupling with the first channel to a first voltage level for charging the first channel to the first voltage level, charging an array common source electrically coupling with the first bit line for further charging the first channel to a second voltage level higher than the first voltage level, and cutting off the electrical coupling between the first bit line and the first channel for preparing to apply the program voltage to the selected word line.

Methods of reducing program disturb by array source coupling in 3D NAND memory devices

In certain aspects, a memory device includes a memory cell array having rows of memory cells, word lines respectively coupled to the rows of memory cells, and a peripheral circuit coupled to the memory cell array through the word lines. The peripheral circuit is configured to program a row of memory cells using a first program voltage and verify the programmed row of memory cells using a verify voltage and a sample voltage smaller than the verify voltage. The peripheral circuit is also configured to obtain a first number of memory cells of the programmed row of memory cells based on the sample voltage. The peripheral circuit is further configured to predict, based on the first number of memory cells and the sample voltage, a second number of memory cells of the programmed row of memory cells that fail to pass the verification.

Memory device and program operation thereof

In certain aspects, a memory device includes an array of memory cells including a plurality of rows of memory cells, a plurality of word lines respectively coupled to the plurality of rows of memory cells, and a peripheral circuit coupled to the plurality of word lines and configured to perform an erase operation on a selected row of memory cells of the plurality of rows of memory cells. The selected row of memory cells is coupled to a selected word line. To perform the erase operation, the peripheral circuit is configured to discharge an unselected word line coupled to an unselected row of memory cells of the plurality of rows of memory cells from an initial voltage to a discharge voltage in a first time period, and float the unselected word line in a second time period after the first time period.

Memory device and erase operation thereof

A memory device includes a plurality of memory cells. Each row of the plurality of memory cells is coupled to a respective one of a plurality of wordlines. A method of programming the memory device includes applying a program voltage to a selected wordline of the plurality of wordlines. The method also includes applying a series of incremental verifying voltages to the selected wordline in a first time period after applying the program voltage. The method further includes floating an unselected wordline of the plurality of wordlines in a second time period at least partially overlapping the first time period. The unselected wordline is adjacent to the selected wordline.

Method of programming in flash memory devices

A sense circuit of a memory cell includes a first switch, a sense node, a third switch, a connection node, a fourth switch, and a memory cell coupled in series. A boost driver is coupled to the sense node. A second switch and the connection node are coupled in series. The boost driver outputs a first voltage when the first, second, third, fourth switches are turned on. The third switch is then turned off and the boost driver outputs a second voltage higher than the first voltage such that the voltage level at the sense node is not higher than a system voltage. The third switch is turned on, then turned off and the boost driver outputs an intermediate voltage between the first voltage and the second voltage. A state of the memory cell is determined during output of the intermediate voltage.

Sense circuit and sensing operation method in flash memory devices

An integration method for a 3D NAND flash memory device includes disposing a plurality of 3D triple-level cell (TLC) NAND flash memories on a CMOS die; disposing at least a NOR Flash memory on the CMOS die of the 3D NAND flash memory device; and connecting the at least a NOR Flash memory to an Open NAND Flash Interface (ONFI) of the 3D NAND flash memory device; wherein the at least a NOR Flash memory is disposed on an unused area of the CMOS die.

3D NAND flash memory device and integration method thereof

A method of programming a flash memory device includes selecting a first wordline of a plurality of wordlines to select a selected wordline, the selected wordline corresponding to a target memory cell and performing a programming loop. The programming loop includes applying a program voltage to the selected wordline and performing a verification to the target memory cell. The verification includes applying a pre-pulse voltage to the selected wordline, applying a plurality of pass voltages to unselected wordlines of the plurality of wordlines, after applying the pre-pulse voltage, applying a series of incremental verifying voltages to the selected wordline, and after applying the pre-pulse voltage, applying a floating voltage to a second wordline of the plurality of wordlines. The second wordline being adjacent to the selected wordline is programmed after the selected wordline.

A memory device includes a memory array, a first buffer, a second buffer, a repair logic circuit and an internal memory. The method of operating the memory device includes: the repair logic circuit receiving a bad column table from the internal memory, the bad column table containing information of a bad column in the memory array; the first buffer receiving first data; the repair logic circuit receiving the first data from the first buffer; and the repair logic circuit mapping the first data onto second data according to the bad column table.

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Wuhan, China

Chunyuan Hou