Taiwan Semiconductor Manufacturing Comp. Ltd.

ChunHung Chen

Sheng-Chen Wang

Jung-Yu Li

Chin Wei Chuang

Shih-Sian Huang

Jerry Chen

Bo-An Chen

Chen-Hua Tsai

Yu Chi Tsai

A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves. The method further includes spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region includes a plurality of second grooves. The method further includes spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region includes a plurality of third grooves.

Method of using polishing pad

A planarization process is performed to a wafer. In various embodiments, the planarization process may include a chemical mechanical polishing (CMP) process. A byproduct generated by the planarization process is collected and analyzed. Based on the analysis, one or more process controls are performed for the planarization process. In some embodiments, the process controls include but are not limited to process endpoint detection or halting the planarization process based on detecting an error associated with the planarization process.

Performing planarization process controls in semiconductor fabrication

Systems and methods are provided for predicting irregular motions of one or more mechanical components of a semiconductor processing apparatus. A mechanical motion irregular prediction system includes one or more motion sensors that sense motion-related parameters associated with at least one mechanical component of a semiconductor processing apparatus. The one or more motion sensors output sensing signals based on the sensed motion-related parameters. Defect prediction circuitry predicts an irregular motion of the at least one mechanical component based on the sensing signals.

Irregular mechanical motion detection systems and method

A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves, a first material property of the first region varies in a thickness direction of the polishing pad, each of the plurality of first grooves extends through at least two variations in the first material property, and the first material property comprises porosity, specific gravity or absorbance. The method further includes spreading the slurry across a second region of the polishing pad at a second rate different from the first rate, wherein the second region comprises a plurality of second grooves.

A method of conditioning a polishing pad includes positioning a conditioning head to bring a conditioning pad into contact with a polishing surface of a polishing pad. The method further includes generating a first pressure signal using a first pressure sensor based on a force being applied to the polishing surface by the conditioning pad. The method further includes generating a surface condition signal using an optical scanner. The method further includes adjusting the positioning of the conditioning pad in response to at least one of the first pressure signal or the surface condition signal.

Method for CMP pad conditioning

A pad removal method includes affixing a first end of a pad guide to a first edge location of a pad. The pad removal method further includes affixing a second end of the pad guide to a second edge location of the pad. The pad removal method further includes moving the first end from a first position, a first distance from the second edge location, to a second position, a second distance from the second edge location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the diameter of the pad.

Pad removal method

A pad removal device includes a pad guide extending along a first direction. The pad guide includes a first affixing component configured to affix a first end of the pad guide to a pad at a first pad edge location, and a second affixing component configured to affix a second end of the pad guide to the pad at a second pad edge location opposite the first pad edge location. The pad removal device further includes an actuator attached to the pad guide, and a control assembly coupled to the actuator and configured to cause the actuator to move the first end toward the second end along the first direction. The pad guide is configured to extend in a second direction different from the first direction by an amount dependent on a distance between the first end and the second end.

Pad removal device and method

A polishing pad includes a first region having a first geometric property and a first material property. The polishing pad further includes a second region having a second geometric property and a second material property, wherein the second region is closer to an edge of the polishing pad than the first region. The first geometric property is different from the second geometric property; or the first material property is different from the second material property.

Polishing pad and method of using

A chemical mechanical polishing apparatus including a conditioning head having a first pressure sensor and a controller configured to adjust at least one of a position or a rotation of the conditioning pad responsive to the first pressure data. The conditioning head is adjustable between a first position and a second position, the conditioning head and a polishing pad are in contact when the conditioning head is in the second position, and the first pressure sensor generates first pressure data when the conditioning head is in the second position.

Apparatus and method for CMP pad conditioning

A pad removal device includes a pad guide having a first end and a second end along a first direction, an actuator attached to the first end, and a control assembly coupled to the actuator. The control assembly is configured to cause the actuator to move the first end toward the second end along the first direction, and the pad guide is configured to extend in a second direction perpendicular to the first direction by an amount dependent on a distance between the first end and the second end.

To provide improved planarization, techniques in accordance with this disclosure include a CMP station that includes a support plate having a plurality of apertures. An aperture of the plurality of apertures has a first opening and a second opening connected by a slot. Other systems and methods are also disclosed.

Growing community of inventors

Youngjing, Taiwan

ChunHung Chen