Hon Hai Precision Industry Co., Ltd.

Miics & Partners (shenzhen) Co., Ltd.

Chung-Pei Wang

Ga-Lane Chen

Feng-Yuen Dai

Chia-Ying Wu

Hung-Lien Yeh

Chao-Tsang Wei

Bing-Heng Lee

Jih-Chen Liu

Ching-Chou Chang

Wei-Cheng Ling

Chien-Hao Huang

A method for cutting glass is disclosed. A glass substrate is provided, the glass substrate includes at least one cutting surface, some micro-fractures are formed on the cutting surface. A conductivity material is provided and coated on the cutting surface to form a conductivity material layer. The conductivity material layer can absorb laser energy. The conductivity material layer is irradiated by laser. The glass substrate adjoined to the cutting surface is fused to repair the micro-fractures.

Method for cutting glass

An sputtering device includes a carrier that includes a main body and support members. The main body defines a receiving space and includes a lateral surface defining at least one groove extending along a longitudinal direction. The receiving space and the at least one groove communicate with each other. The at least one groove is defined by a first surface and a second surface. The first surface defines recessed portions along the longitudinal direction and communicates with the receiving space. The support members are used for hanging workpieces. Each of the support members includes at least one support arm protruding from the lateral surface and is selectively and movably retained by one of the recessed portions.

Sputtering device

An IR-cut filter includes a substrate and an infrared filtering film. The substrate is made of sapphire, and includes a first surface and a second surface opposite to the first surface. The infrared filtering film covers the first surface of the substrate and increases the reflectivity in relation to infrared light, thus filtering out the infrared light. The infrared filtering film includes a number of first high refraction index layers and a number of first low refraction index layers alternately stacked on the first surface of the substrate.

Infrared-cut filter with sapphire substrate and lens module including the infrared-cut filter

A method for cutting chemically strengthened glass is provided. The chemically strengthened glass includes a first stress layer, a second stress layer, and a tension layer sandwich between the first stress layer and the second stress layer. The method includes: using a green pulsed laser to cut the first stress layer, wherein the green pulsed laser includes a first green pulsed laser having femtosecond level and a second green pulsed laser having nanosecond level; using a ultraviolet pulsed laser to cut the tension layer, wherein the ultraviolet pulsed laser includes a first ultraviolet pulsed laser having femtosecond level and a second ultraviolet pulsed laser having nanosecond level; and using the green pulse layer to cut the second stress layer.

Method for cutting chemically strengthened glass

A conveying device for a deposition device includes a transport device and a carrier. The transport device includes a main body, two wheels, a connection shaft, and a first bevel gear. The connection shaft is mounted on the main body. The two wheels are mounted on two opposite ends of the connection shaft. The first bevel gear is sleeved on the connection shaft. The carrier includes a revolving frame, a rotating shaft, a second bevel gear, and at least one carrying bar. The rotating shaft is mounted on the revolving frame. The second bevel gear is sleeved on one end of the rotating shaft and meshed with the first bevel gear. The revolving frame rotates relative to the rotating shaft. The at least one carrying bar is mounted on the revolving frame and driven by the rotating shaft to rotate. Each carrying bar includes supporting elements for carrying workpieces.

Conveying device having carrier with revolving frame and deposition device using same

A coating device includes a main body, a transport device, at least one loader, a driving device. The main body has a top plate, a bottom plate, and a pair of sidewalls connecting the top plate and bottom plate. The sidewalls respectively define an input gate and an output gate. The transport device includes a transport track passing through the input gate and the output gate, and at least one lifting arm mounted on the transport track. Each loader is configured for loading workpieces and includes a rotary shaft, at least one loading frame rotatably connected with the rotary shaft. The driving device is mounted on the top plate. Each lifting arm is configured for clamping a corresponding loader and transporting the corresponding loader to engage with the driving device. The driving device rotates the corresponding loader rotary shaft through the rotary shaft of the corresponding loader.

Coating device

A coating method for forming a pattern on a workpiece is provided. First, a workpiece surface is provided. Second, a mask having a shape conforming to a predetermined pattern is provided. Next, the workpiece surface includes a first portion exposed outside and a second portion shielded by the mask. A shielding layer is formed on the exposed first portion of the workpiece surface. The mask is removed from the workpiece to expose the second portion. A coating layer over the shielding layer and the exposed second portion is formed. The coating layer consists of a first part overlaying the shielding layer and a second part overlaying the second portion. The mask is attached onto the coating layer and aligned with the second portion of the workpiece surface. The first part of the coating layer, the shielding layer, and the mask are then removed.

Coating method for forming pattern on workpiece

A sputter-coating apparatus is configured for forming coatings on a plurality of workpieces, and includes a deposition chamber defining a cavity, a plurality of targets received in the cavity, and a plurality of supporting assemblies. Each target includes a first target plate and an opposite second target plate. The supporting assemblies are received in the cavity and arranged between the first target plates and the second target plates. Each supporting assembly includes a hollow rotating post for rotating about a first axis substantially parallel to a lengthwise direction thereof, at least one support extending from the post, and at least one driving unit. Each support includes a connecting arm rotatably connected to the post and a fixing portion attached to the connecting arm for supporting a workpiece. The driving unit is configured for driving each connecting arm to rotate relative to the corresponding post about a second axis.

Sputter-coating apparatus

A sputtering device includes a main body and a loading device received in the main body. The main body includes a top portion, a bottom portion, and a sidewall connected between the top portion and the bottom portion, an upper bearing mounted on the top portion, and a lower bearing mounted on the bottom portion. The loading device includes an outer frame, an inner frame received in the outer frame, and a gear device arranged between the outer frame and the in inner frame. The outer frame is rotatably connected to the upper bearing and includes a plurality of first rods arranged in a first circle. The inner frame is rotatably connected to the lower bearing and includes a plurality of second rods arranged in a second circle. The gear device is configured for bringing the outer frame and the inner frame to rotate in opposite directions.

Loading device and sputtering device using same

A carrier for use during sputtering includes a main body and support members. The main body defines a receiving space and includes a lateral surface defining at least one groove extending along a longitudinal direction. The receiving space and the at least one groove communicate with each other. The at least one groove is defined by a first surface and a second surface. The first surface defines recessed portions along the longitudinal direction and communicates with the receiving space. The support members are used for hanging workpieces. Each of the support members includes at least one support arm protruding from the lateral surface and is selectively and movably retained by one of the recessed portions.

Carrier and sputtering device using the same

A sputtering apparatus includes a preheating chamber, a deposition chamber, a passage in communication with the preheating chamber and the deposition chamber, a first support assembly received in the preheating chamber, a second support assembly received in the deposition chamber, a number of posts capable of mounting on each of the first and second support assemblies, a transferring robot arranged in the preheating chamber, and a magnetic assembly fixed on the transferring robot. The transferring robot is configured for demounting the post from the two support assemblies, transferring the demounted post between the preheating chamber and the deposition chamber, and mounting the transferred post on the two support assemblies. The magnetic assembly is configured for collecting iron workpieces dropped on a bottom in the preheating chamber, the deposition chamber, or the passage.

Sputtering apparatus

A tray for a vacuum deposition apparatus includes a base having an upper surface, a number of cooling pipes fixed to the base each having a plurality of alternately arranged cooling portions and conduits, and a number of engaging members. The cooling portions protrude from the upper surface and each has a cooling channel therein. Two ends of the cooling channel communicate with two adjacent conduits. Each of the engaging members each has a hole surrounding a corresponding cooling portion therein.

Tray for vacuum deposition apparatus

A gas-inputting device for a vacuum sputtering apparatus includes at least one tapered tube. Each tapered tube includes a open end, a closed end, and a conical surface. The small end is configured for introducing gas into the tapered tube. The large end opposes to the open end. Each of the at least one tapered tube tapers from the closed end to the open end. The conical surface connects the open end to the closed end. A plurality of gas holes of a same size are defined in the conical surface and equidistantly arranged along the center axis of the tapered tube from the open end to the closed end.

Gas-inputting device for vacuum sputtering apparatus

A coating method for forming a pattern on a workpiece is provided. The method includes the follow steps: providing a workpiece having a surface, forming a coating layer over the surface using a physical vapor deposition method; providing a mask having a shape conforming to a predetermined pattern; attaching the mask to the surface such that a portion of the coating layer is shielded. The coating layer consists of a shielded portion and an unwanted portion surrounding the shielded portion. Finally, removing the unwanted portion of the coating layer using a magnetic abrasive finishing method, and removing the mask to obtain the shielded portion having the predetermined pattern on the workpiece.

An exemplary device for film coating, is provided. The device has an evaporating unit, wherein the evaporating unit includes a driving member and a carrier. The driving member has an extending rotatable shaft. The carrier includes a main body, a plurality of branches and a plurality of crucibles. The branches each extend from the main body. The crucibles each are supported by a respective one of the branches and configured for receiving a film material therein. The rotatable shaft is engaged in the main body and thereby rotating the carrier.

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Taipei Hsien, Taiwan

Chung-Pei Wang