I-shou University

Chung-Long Pan

Rong-Ching Wu

Yu-Jung Huang

Mei-Hui Guo

Tsu-Chung Tan

Shih-Chun Lin

A defect detection method for a multilayer daisy chain structure, including: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a daisy chain structure; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that the multilayer daisy chain has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

Defect detection method for multilayer daisy chain structure and system using the same

A defect detection method for a 3D chip and a system using the same are provided. The method includes: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a 3D chip; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that a Through Silicon Via of a single die 3D chip or a stacked die 3D chip has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

Defect detection method for 3D chip and system using the same

A filter configuration including a substrate, a primary microstrip line and a first defected ground structure is disclosed. The substrate has a first face and a second face. The second face is a ground face. The primary microstrip line is arranged on the first face and extends in a first direction. The first defected ground structure is arranged on the second face. The first defected ground structure includes a first section, a first circular section, a second section, a second circular section and a third section that are connected to each other in sequence in a second direction perpendicular to the first direction. The second section is covered by the primary microstrip line in a vertical direction perpendicular to the first and second faces. The primary microstrip line has a width equal to a minimum length of the second section. As such, the filtering effect can be improved.

Filter configuration

A step impedance resonator filter including a first resonator and a second resonator is disclosed. The first resonator includes a first coupled line and a first tapped line connected to the first coupled line. The second resonator includes a second coupled line and a second tapped line connected to the second coupled line. The second coupled line is coupled with the first coupled line. The first tapped line has a first central line which is spaced from an end face of the first coupled line at a first distance. The second tapped line has a second central line which is spaced from an end face of the second coupled line at a second distance. The first distance is larger than the second distance. As such, the performance of the step impedance resonator filter can be improved.

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Kaohsiung, Taiwan

Chung-Long Pan