Applied Materials, Inc.

Christopher Snedigar

Dmitry Lubomirsky

Nitin K Ingle

Ming Xia

Dongqing Yang

Tien Fak Tan

Peter Hillman

Lala Zhu

Embodiments of the present technology may include a method of etching. The method may include mixing plasma effluents with a gas in a first section of a chamber to form a first mixture. The method may also include flowing the first mixture to a substrate in a second section of the chamber. The first section and the second section may include nickel plated material. The method may further include reacting the first mixture with the substrate to etch a first layer selectively over a second layer. In addition, the method may include forming a second mixture including products from reacting the first mixture with the substrate.

Process window widening using coated parts in plasma etch processes

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Hayward, CA, United States of America

Christopher Snedigar