Lam Research Corporation

Lam Researech Corporation

Christopher J Pena

Michael C Kellogg

John Edward Daugherty

Richard Howard Gould

David Trussell

Klay Kunkel

Andrew C Lee

Jeffrey J Farber

Glenn W Travis

Edward Orbeta

A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.

Wafer transport assembly with integrated buffers

A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.

A gas delivery substrate for mounting gas supply components of a gas delivery system for a semiconductor processing apparatus is provided. The substrate may include a plurality of layers having major surfaces thereof bonded together forming a laminate with openings for receiving and mounting first, second, third and fourth gas supply components on an outer major surface. The substrate may include a first gas channel extending across an interior major surface that at least partially overlaps a second gas channel extending across a different interior major surface. The substrate may include a first gas conduit including the first gas channel connecting the first gas supply component to the second gas supply component, and a second gas conduit including the second channel connecting the third gas supply component to the fourth gas supply component. Also disclosed are various techniques for manufacturing gas delivery substrates.

Monolithic gas distribution manifold and various construction techniques and use cases therefor

A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

Component-locating templates or masks for use with positioning fluid-flow components on monolithic ceramic substrates are provided, as well as techniques for the manufacture of such templates.

Monolithic manifold mask and substrate concepts

A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.

A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs

A brush core for use in cleaning a substrate is provided. The brush core includes an elongated cylinder having a first end and a second end. The first end of the elongated cylinder is configured to receive a drive hub. The second end is configured to receive fluid into an inner cavity of the elongated cylinder. The inner cavity is configured to distribute fluid to a plurality of fluid channels having a first diameter. The plurality of fluid channels are configured to distribute the fluid to corresponding distribution holes having a second diameter. The brush core further including a plurality of non-fluid distributing pockets defined on the outer surface. The corresponding distribution holes and plurality of non-fluid distributing pockets are configured so that a thickness of a solid portion of the brush core is substantially similar. In one embodiment, the first diameter is less than the second diameter.

Brush core assembly

An apparatus for chemically-mechanically polishing a semiconductor wafer comprises a receiving surface attached with a frame; a loading mechanism in contact with the receiving surface, the loading mechanism being configured to load measured portions of a wafer-polishing member containing a fixed abrasive onto the receiving surface; a reciprocation device attached with at least a portion of the receiving surface, the reciprocation device being powered to move the receiving surface in a linear, bi-directional motion; and a wafer holder positioned to releasably hold a wafer adjacent to the receiving surface. Methods of chemically-mechanically polishing semiconductor wafers are also provided.

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Hayward, CA, United States of America

Christopher J Pena