Schlumberger Technologies, Inc.

Applied Materials, Inc.

Applied Materials Israel Limited

Christopher G Talbot

Chiwoei Wayne Lo

Douglas K Masnaghetti

James Henry Brown

Hou Tee Ng

Ron Naftali

Neil W Richardson

William T Lee

Ronny Soetarman

Christopher Dennis Bencher

Majeed Foad

Dmitry Shur

Alexander Kadyshevitch

Li Wang

John Christopher Moran

Hongyu Ximen

Thomas M Trexler

Harry S Gallarda

Adam Rhoads

Mariel Stoops

Luis Camilo Orjuela

An additive manufacturing apparatus includes a platform, a dispenser to dispense layers of feed material on the platform, and a fusing system including an energy source to generate an energy beam having an adjustable intensity profile, an actuator to cause the energy beam to traverse across an outermost layer of feed material, and a controller coupled to the actuator and the energy source. The controller is configured to cause the energy source to adjust the intensity profile of the energy beam on the outermost layer of feed material based on a traversal velocity and/or a traversal direction of the light beam across the outermost layer of feed material.

Controlling an intensity profile of an energy beam in additive manufacturing based on travel direction or velocity

An additive manufacturing apparatus includes a platform, a dispenser to dispense layers of feed material on the platform, and a fusing system to direct an energy beam to fuse at least a portion of the outermost layer of feed material. The fusing system includes an energy source to emit the energy beam, a deformable mirror to receive the energy beam and reflect the energy beam, wherein a shape of the deformable mirror defines at least in part an intensity profile of the energy beam on the outermost layer of feed material, an actuator coupled to the deformable mirror, and a controller coupled to the actuator and configured to cause the actuator to deform the shape of the deformable mirror to adjust the intensity profile of the energy beam on the outermost layer of feed material in accordance to a desired profile.

Controlling an intensity profile of an energy beam with a deformable mirror in additive manufacturing

An extreme ultraviolet (EUV) substrate inspection system and method of manufacturing thereof, includes: an EUV source directing EUV illumination through an aperture; a light detector detecting mask illumination with reduced off axis rays reflected off from a substrate; and a computing device processing image data detected by the light detector.

Extreme ultraviolet (EUV) substrate inspection system with simplified optics and method of manufacturing thereof

A method and apparatus for wafer inspection. The apparatus is capable of testing a sample having a first layer that is at least partly conductive and a second, dielectric layer formed over the first layer, following production of contact openings in the second layer, the apparatus includes: (i) an electron beam source adapted to direct a high current beam of charged particles to simultaneously irradiate a large number of contact openings at multiple locations distributed over an area of the sample; (ii) a current measuring device adapted to measure a specimen current flowing through the first layer in response to irradiation of the large number of contact openings at the multiple locations; and (iii) a controller adapted to provide an indication of the at least defective hole in response to the measurement.

High current electron beam inspection

A method of detecting defects in a patterned substrate includes positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV; operating the charged-particle-beam optical column to acquire images of a region of the patterned substrate lying within the FOV by scanning the charged-particle beam over the patterned substrate; and comparing the acquired images to a reference to identify defects in the patterned substrate.

Detection of defects in patterned substrates

One embodiment of the present invention is a method of detecting defects in a patterned substrate, including: (a) positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV; (b) operating the charged-particle-beam optical column to acquire images of a region of the patterned substrate lying within the FOV by scanning the charged-particle beam over the patterned substrate; and (c) comparing the acquired images to a reference to identify defects in the patterned substrate.

Methods and apparatus are provided for inspecting a patterned substrate, comprising: preparing a reference image and a test image, extracting features from the reference image and extracting features from the test image, matching features of the reference image and features of the test image; and comparing features of the reference image and of the test image to identify defects. Embodiments include apparatus for inspecting patterned substrates, computer-readable media containing instructions for controlling a system having a processor for inspecting patterned substrates, and computer program products comprising a computer usable media having computer-readable program code embodied therein for controlling a system for inspecting patterned substrates. The images can be electron-beam voltage-contrast images.

Feature-based defect detection

Methods are provided for exposing a selected feature of an IC device, such as a selected conductor, from the back side of the substrate without disturbing adjacent features of the device, such as active regions. One such method comprises: (a) determining a region of the IC device in which the selected feature is located; (b) acquiring from the back side of the substrate an IR optical microscope image of the region; (c) aligning the IR optical microscope image with a coordinate system of a milling system; and (d) using structures visible in the IR optical microscope image as a guide, operating the milling system to expose the selected feature from the back side of the IC device without disturbing adjacent features.

Through-the-substrate investigation of flip-chip IC's

Defects in a patterned substrate are detected by positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle imaging system having a field of view (FOV) with a substantially uniform resolution over the FOV; operating the charged-particle-beam optical column to acquire images over multiple subareas of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while maintaining the charged-particle-beam optical column fixed relative to the patterned substrate; and comparing the acquired images to a reference to identify defects in the patterned substrate. The use of a large-FOV imaging system with substantially uniform resolution over the FOV allows acquisition of images over a wide area of the patterned substrate without requiring mechanical stage moves, thereby reducing the time overhead associated with mechanical stage moves. Multiple columns can be ganged together to further improve throughput.

Apparatus for detecting defects in patterned substrates

A method of testing a semiconductor structure such as a finished or part-finished semiconductor wafer, a die on such a wafer, part of such a die, or even one functional element (e.g. a transistor or memory cell) of such a die. The method includes the steps of charging at least a part of the semiconductor structure; applying an electric field perpendicular to a surface of the structure while charging so as to determine charging potential and polarity (i.e. charging either positively or negatively); interrogating the structure including the charged part with a charged particle beam, such as an electron beam, so as to obtain voltage contrast data for the structure; and analyzing the data to determine the functionality of the element. Apparatus according to the invention for testing semiconductor structures, includes: a system for applying charge to at least part of the semiconductor structure, such as an electron beam, flood gun or mechanical probe; an electric field generator, typically an electrode spaced from the surface of the structure, which applies an electric field perpendicular to a surface of the structure so as to determine the potential and polarity of the charge applied to the element (i.e. positive or negative charge); a charged particle beam device such as an electron beam for interrogating the charged element; and a detector such as a secondary electron detector which obtains voltage contrast data from the structure on interrogation with the charged particle beam.

Methods and apparatus for testing semiconductor and integrated circuit structures

Defects in a patterned substrate are detected by positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle imaging system having a field of view (FOV) with a substantially uniform resolution over the FOV; operating the charged-particle-beam optical column to acquire images over multiple subareas of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while maintaining the charged-particle-beam optical column fixed relative to the patterned substrate; and comparing the acquired images to a reference to identify defects in the patterned substrate. The use of a large- FOV imaging system with substantially uniform resolution over the FOV allows acquisition of images over a wide area of the patterned substrate without requiring mechanical stage moves, thereby reducing the time overhead associated with mechanical stage moves. Multiple columns can be ganged together to further improve throughput.

Method of detecting defects in patterned substrates

Through-the-substrate investigation of flip chip IC's

A method for detecting electrical defects in a semiconductor wafer, includes the steps of: a) applying charge to the wafer such that electrically isolated structures are raised to a voltage relative to electrically grounded structures; b) obtaining voltage contrast data for at least a portion of the wafer containing such structures using an electron beam; and c) analyzing the voltage contrast data to detect structures at voltages different from predetermined voltages for such structures. Voltage contrast data can take one of a number of forms. In a simple form, data for a number of positions on a line scan of an electron beam can be taken and displayed or stored as a series of voltage levels and scan positions. Alternatively, the data from a series of scans can be displayed as a voltage contrast image. Analysis can be achieved by comparison of one set of voltage contrast data, for example voltage contrast data from one die on a wafer, with one or more other such sets, for example voltage contrast data for corresponding structures on one or more preceding dice, so as to determine differences therebetween.

Method and apparatus for detecting defects in wafers

Sampling a waveform in an IC device to which a repeating test pattern is applied, includes the steps of: a) defining a portion of the test signal containing a feature of interest; b) applying a sampling signal to an AFM device adjacent a surface of the IC device at a predetermined point during the portion for a series of consecutive repetitions of the test signal pattern, the sampling signal having substantially shorter duration than the feature of interest; c) measuring deflection of a cantilever in the AFM device on application of the sampling signal; and d) determining the voltage at the predetermined point from the measured deflection of the cantilever. The steps can be applied at several points in the portion of interest and the measurements integrated and displayed.

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Menlo Park, CA, United States of America

Christopher G Talbot