Ev Group E. Thallner Gmbh

Christoph Flötgen

Markus Wimplinger

Thomas Wagenleitner

Thomas Plach

Thomas Glinsner

Kurt Hingerl

Florian Schmid

Thomas Wieser

Roman Anzengruber

Alexander Nones

Uwe Kriebisch

Johann Bernauer

This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence:

Method for permanently bonding wafers

A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.

Method for permanent bonding of wafers

This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, the second substrate having at least one reaction layer, with the following steps, especially the following sequence:

A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises:

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Pramerdorf, Austria

Christoph Flötgen