Taiwan Semiconductor Manufacturing Comp. Ltd.

Macronix International Co., Ltd.

United Microelectronics Corp.

Other

Ace Medical Technology Co., Ltd.

Aiwan Semiconductor Manufacturing Company, Ltd.

Ching-Yu Chang

Chin-Hsiang Lin

An-Ren Zi

Chen-Yu Liu

Wei-Han Lai

Chien-Wei Wang

Ming-Hui Weng

Tze-Liang Lee

Joy Cheng

Cheng-Han Wu

Burn Jeng Lin

Ming-Feng Shieh

Yahru Cheng

Siao-Shan Wang

Yu-Chung Su

Tzu-Yang Lin

Jung-Hau Shiu

Chien-Chih Chen

Yen-Yu Chen

Chi-Ming Yang

Jr-Hung Li

Chih-Cheng Liu

Yi-Chen Kuo

Chen-Yu Chen

Yen-Hao Chen

Jei Ming Chen

Wen-Yun Wang

Tien-I Bao

Hai-Ching Chen

Tsai-Sheng Gau

Shing-Chyang Pan

Yu-Lin Yen

Bo-Jiun Lin

Jen Hung Wang

Chun-Kuang Chen

Wei-Liang Lin

Kuei-Shun Chen

Hua-Tai Lin

Kuei-Liang Lu

Ming-Da Cheng

Ru-Gun Liu

Shih-Ming Chang

Ssu-I Fu

Jyh-Shyang Jenq

Hsien-Cheng Wang

Heng-Jen Lee

Burn-Jeng Lin

Clement Hsingjen Wann

Yen-Ming Chen

Chi-Wen Liu

Tsung-Lin Lee

Yung-Sung Yen

Chih-Yuan Ting

Chih-Kai Hsu

Yu-Hsiang Hung

Chi-Cheng Hung

Wen-Chuan Wang

Kuei Shun Chen

Ya Hui Chang

Chi-Lun Lu

Szu-Ping Tung

Yu-Tien Shen

Ta-Hung Yang

Henry Chung

Chang-Cheng Hung

Wei-Chi Cheng

Yuan-Hsiang Lung

Horng-Huei Tseng

Hung-Jui Kuo

Li-Jui Chen

Ryan Chia-Jen Chen

Chien-Ting Lin

Ken-Hsien Hsieh

Li-Wei Feng

Shih-Hung Tsai

Samuel C Pan

Chien-Hung Lin

Tzung-Chi Fu

Chin-Cheng Yang

Kent Kuohua Chang

Hsin-Yu Chen

Kuo-Ching Chiang

Yu-Yu Chen

Shou-Wei Hsieh

Jian-Hong Chen

Kuan-Wei Huang

Chia-Wei Chen

Chun-Hao Lin

Jei-Ming Chen

Ko-Bin Kao

Fu-Jye Liang

Chun-Pei Wu

Li-Kong Turn

Wenpin Lu

Shao-Jyun Wu

Jen-Chieh Shih

Hsin-Huei Chen

Jiing-Feng Yang

Bang-Chein Ho

Yi-Hsing Chen

A method of manufacturing a semiconductor device includes forming a first protective layer over an edge portion of a first main surface of a semiconductor substrate. A metal-containing photoresist layer is formed over the first main surface of the semiconductor substrate. The first protective layer is removed, and the metal-containing photoresist layer is selectively exposed to actinic radiation. A second protective layer is formed over the edge portion of the first main surface of the semiconductor substrate. The selectively exposed photoresist layer is developed to form a patterned photoresist layer, and the second protective layer is removed.

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

A method of forming a pattern in a photoresist layer includes forming a photoresist layer over a substrate, and reducing moisture or oxygen absorption characteristics of the photoresist layer. The photoresist layer is selectively exposed to actinic radiation to form a latent pattern, and the latent pattern is developed by applying a developer to the selectively exposed photoresist layer to form a pattern.

Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern

Embodiments utilize a photoetching process in forming a patterned target layer. After forming a patterned mandrel layer and spacer layer over the patterned mandrel layer, a bottom layer of a photomask is deposited using a chemical vapor deposition process to form an amorphous carbon film. An upper layer of the photomask is used to pattern the bottom layer to form openings for a reverse material. The reverse material is deposited in the openings of the bottom layer, the bottom layer providing both a mask and template function for the reverse material.

Film deposition for patterning process

A method for forming a semiconductor structure is provided. The method includes forming a patterned photoresist layer over a substrate and removing the patterned photoresist layer using a photoresist stripping composition that is free of dimethyl sulfoxide. The photoresist stripping composition includes an organic alkaline compound including at least one of a primary amine, secondary amine, a tertiary amine or a quaternary ammonium hydroxide or a salt thereof, an organic solvent selected from the group consisting of a glycol ether, a glycol acetate, a glycol, a pyrrolidone and mixtures thereof, and a polymer solubilizer.

Non-DMSO stripper for advance package metal plating process

A photoresist layer is formed over a wafer. The photoresist layer includes a metallic photoresist material and one or more additives. An extreme ultraviolet (EUV) lithography process is performed using the photoresist layer. The one or more additives include: a solvent having a boiling point greater than about 150 degrees Celsius, a photo acid generator, a photo base generator, a quencher, a photo de-composed base, a thermal acid generator, or a photo sensitivity cross-linker.

EUV metallic resist performance enhancement via additives

The present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, portions of an adhesion layer, barrier layer and/or seed layer is protected by a layer of an organic mask material as portions of the adhesion layer, barrier layer and/or seed layer are removed. The layer of organic mask material is modified to improve its resistance to penetration by wet etchants used to remove exposed portions of the adhesion layer, barrier layer and/or seed layer. An example modification includes treating the layer of organic mask material with a surfactant that is absorbed into the layer of organic mask material.

Treatment of spin on organic material to improve wet resistance

A method of forming a semiconductor device includes forming a photoresist layer over a mask layer, patterning the photoresist layer, and forming an oxide layer on exposed surfaces of the patterned photoresist layer. The mask layer is patterned using the patterned photoresist layer as a mask. A target layer is patterned using the patterned mask layer as a mask.

Method for forming and using mask

A method of forming a semiconductor device includes forming a mask layer over a substrate and forming an opening in the mask layer. A gap-filling material is deposited in the opening. A plasma treatment is performed on the gap-filling material. The height of the gap-filling material is reduced. The mask layer is removed. The substrate is patterned using the gap-filling material as a mask.

Semiconductor device and method

A method for manufacturing an integrated circuit includes patterning a plurality of photomask layers over a substrate, partially backfilling the patterned plurality of photomask layers with a first material using atomic layer deposition, completely backfilling the patterned plurality of photomask layers with a second material using atomic layer deposition, removing the plurality of photomask layers to form a masking structure comprising at least one of the first and second materials, and transferring a pattern formed by the masking structure to the substrate and removing the masking structure. The first material includes a silicon dioxide, silicon carbide, or carbon material, and the second material includes a metal oxide or metal nitride material.

A method of forming a photoresist pattern includes forming an upper layer including a floating additive polymer over a photoresist layer formed on a substrate. The photoresist layer is selectively exposed to actinic radiation. The photoresist layer is developed to form a pattern in the photoresist layer, and the upper layer is removed. The floating additive polymer is a siloxane polymer.

Photoresist composition and method of forming photoresist pattern

A method is provided including forming a first layer over a substrate and forming an adhesion layer over the first layer. The adhesion layer has a composition including an epoxy group. A photoresist layer is formed directly on the adhesion layer. A portion of the photoresist layer is exposed to a radiation source. The composition of the adhesion layer and the exposed portion of the photoresist layer cross-link using the epoxy group. Thee photoresist layer is then developed (e.g., by a negative tone developer) to form a photoresist pattern feature, which may overlie the formed cross-linked region.

Adhesion layer for multi-layer photoresist

Method of manufacturing semiconductor device includes forming photoresist layer over substrate. Forming photoresist layer includes combining first precursor and second precursor in vapor state to form photoresist material, wherein first precursor is organometallic having formula: MRX, where M at least one of Sn, Bi, Sb, In, Te, Ti, Zr, Hf, V, Co, Mo, W, Al, Ga, Si, Ge, P, As, Y, La, Ce, Lu; R is substituted or unsubstituted alkyl, alkenyl, carboxylate group; X is halide or sulfonate group; and 1≤a≤2, b≥1, c≥1, and b+c≤5. Second precursor is at least one of an amine, a borane, a phosphine. Forming photoresist layer includes depositing photoresist material over the substrate. The photoresist layer is selectively exposed to actinic radiation to form latent pattern, and the latent pattern is developed by applying developer to selectively exposed photoresist layer to form pattern.

Method of manufacturing a semiconductor device

A method of manufacturing semiconductor device includes forming a multilayer photoresist structure including a metal-containing photoresist over a substrate. The multilayer photoresist structure includes two or more metal-containing photoresist layers having different physical parameters. The metal-containing photoresist is a reaction product of a first precursor and a second precursor, and each layer of the multilayer photoresist structure is formed using different photoresist layer formation parameters. The different photoresist layer formation parameters are one or more selected from the group consisting of the first precursor, an amount of the first precursor, the second precursor, an amount of the second precursor, a length of time each photoresist layer formation operation, and heating conditions of the photoresist layers. The multilayer photoresist structure is selectively exposed to actinic radiation to form a latent pattern, and the latent pattern is developed by applying developer to the selectively exposed multilayer photoresist structure to form the pattern.

A method includes illuminating radiation to a resist layer over a substrate to pattern the resist layer. The patterned resist layer is developed by using a positive tone developer. The patterned resist layer is rinsed using a basic aqueous rinse solution. A pH value of the basic aqueous rinse solution is lower than a pH value of the developer, and a rinse temperature of rinsing the patterned resist layer is in a range of about 20° C. to about 40° C.

Lithography method for positive tone development

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Yilang County, Taiwan

Ching-Yu Chang