Taiwan Semiconductor Manufacturing Comp. Ltd.

TSMC Solid State Lighting Ltd.

Epistar Corporation

Macronix International Co., Ltd.

Au Optronics Corporation

Lextar Electronics Corporation

Young Optics Inc.

Ching-Yi Chen

Hao-Yu Yang

Hsin-Hung Chen

Yu-Sheng Tang

Chih-Wei Chang

Wei-Yip Loh

Hung-Hsu Chen

Tzu-Wen Shih

Li-Te S Lin

Chun-Feng Nieh

Hsiao-Wen Lee

Sheng-Hsuan Lin

Wei-Yen Woon

Sheng-Shin Guo

Chi Xiang Tseng

Hsun Chang

Chung-Ru Yang

Hao-Wei Ku

Ming-Hsing Tsai

Chun-Hsien Huang

Wei-Jung Lin

Tzong-Liang Tsai

Ru-Shi Liu

Chung Yu Wang

Shang-Yu Tsai

Yu-Chun Lee

Chih-wei Chang

Sheng-Kai Hsu

Yi-Hao Kang

Ya-Yi Cheng

Tien-Ming Lin

Yi-Hsiang Chao

Yi-Hsueh Chen

Tien-Min Lin

Yi-Ting Tsai

Kevin Lee

Chun Che Lin

Peng-Hao Hsu

Shu-Lan Chang

Ching-Hung Wang

Long-Fan Lin

Chiung-Fang Hsieh

Pei Shan Chang

Chong-Ci Hu

Shu-Shung Lin

Chi-Yung Liu

Ching-Feng Yeh

A method includes forming a dielectric layer over a source/drain region. An opening is formed in the dielectric layer. The opening exposes a portion of the source/drain region. A conductive liner is formed on sidewalls and a bottom of the opening. A surface modification process is performed on an exposed surface of the conductive liner. The surface modification process forms a surface coating layer over the conductive liner. The surface coating layer is removed to expose the conductive liner. The conductive liner is removed from the sidewalls of the opening. The opening is filled with a conductive material in a bottom-up manner. The conductive material is in physical contact with a remaining portion of the conductive liner and the dielectric layer.

Contact features of semiconductor device and method of forming same

A quantum dot oil-based ink is provided. The quantum dot oil-based ink includes a quantum dot material, a dispersing solvent, a viscosity modifier, and a surface tension modifying solution. The dispersing solvent includes a linear alkane having 6 to 14 carbon atoms. The viscosity modifier includes an aromatic hydrocarbon having 10 to 18 carbon atoms or a linear olefin having 16 to 20 carbon atoms. The surface tension modifying solution includes a hydrophobic polymer material and a nonpolar solvent.

Quantum dot oil-based ink and pattern recognition system

A nitrogen plasma treatment is used on an adhesion layer of a contact plug. As a result of the nitrogen plasma treatment, nitrogen is incorporated into the adhesion layer. When a contact plug is deposited in the opening, an interlayer of a metal nitride is formed between the contact plug and the adhesion layer. A nitrogen plasma treatment is used on an opening in an insulating layer. As a result of the nitrogen plasma treatment, nitrogen is incorporated into the insulating layer at the opening. When a contact plug is deposited in the opening, an interlayer of a metal nitride is formed between the contact plug and the insulating layer.

Treatment for adhesion improvement

A method includes etching a dielectric layer of a substrate to form an opening in the dielectric layer, forming a metal layer extending into the opening, performing an anneal process, so that a bottom portion of the metal layer reacts with a semiconductor region underlying the metal layer to form a source/drain region, performing a plasma treatment process on the substrate using a process gas including hydrogen gas and a nitrogen-containing gas to form a silicon-and-nitrogen-containing layer, and depositing a metallic material on the silicon-and-nitrogen-containing layer.

Barrier-free approach for forming contact plugs

A lens is formed over one or more light-emitting devices disposed over a substrate. The lens includes a trench that circumferentially surrounds the one or more light-emitting devices. The trench is filled with a phosphor-containing material.

Batwing LED with remote phosphor configuration

An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.

Wafer level reflector for LED packaging

A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating.

Bat-wing lens design with multi-die

A lighting apparatus includes a substrate. One or more light-emitting devices are disposed over the substrate. A lens is molded over the substrate and over the one or more light-emitting devices. A recess is disposed in the lens. The recess circumferentially surrounds the one or more light-emitting devices in a top view. The recess is at least partially filled with phosphor particles.

A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

A light emitting device includes a plurality of light emitting modules and a plurality of voltage controlling circuits capable of being independently controlled. Each voltage controlling circuit includes a dynamic voltage controlling module, a current controlling module, and a luminance controlling module. The dynamic voltage controlling module is used for comparing a voltage level at a second terminal of the light emitting module and a voltage level of a reference voltage source, so as to output a first voltage. The current controlling module is used for adjusting a bias current flowing through the light emitting module, according to the first voltage. The luminance controlling module is used for comparing the first voltage with a clock signal, and for generating a pulse width modulation signal according to a result of the comparison, so as to dynamically control a duty cycle of the light emitting module.

Light emitting device and driving method thereof

Growing community of inventors

Hsinchu, Taiwan

Ching-Yi Chen