Growing community of inventors

Fremont, CA, United States of America

Ching Ling Meng

Average Co-Inventor Count = 6.19

ph-index = 5

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 76

Ching Ling MengChristopher F Bevis (9 patents)Ching Ling MengCharles L Chen (9 patents)Ching Ling MengHaiguang Chen (9 patents)Ching Ling MengKurt Lehman (9 patents)Ching Ling MengAnantha R Sethuraman (9 patents)Ching Ling MengRonald L Allen (9 patents)Ching Ling MengRobert Shinagawa (9 patents)Ching Ling MengThanassis Trikas (9 patents)Ching Ling MengHanyou Chu (3 patents)Ching Ling MengXinkang Tian (3 patents)Ching Ling MengQiang Zhao (3 patents)Ching Ling MengHolger Tuitje (3 patents)Ching Ling MengIvan Maleev (1 patent)Ching Ling MengChing Ling Meng (13 patents)Christopher F BevisChristopher F Bevis (54 patents)Charles L ChenCharles L Chen (36 patents)Haiguang ChenHaiguang Chen (30 patents)Kurt LehmanKurt Lehman (19 patents)Anantha R SethuramanAnantha R Sethuraman (16 patents)Ronald L AllenRonald L Allen (13 patents)Robert ShinagawaRobert Shinagawa (10 patents)Thanassis TrikasThanassis Trikas (9 patents)Hanyou ChuHanyou Chu (34 patents)Xinkang TianXinkang Tian (28 patents)Qiang ZhaoQiang Zhao (26 patents)Holger TuitjeHolger Tuitje (16 patents)Ivan MaleevIvan Maleev (19 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Kla-tencor Technologies Corporation (9 from 641 patents)

2. Tokyo Electron Limited (4 from 10,295 patents)


13 patents:

1. 12261030 - Normal-incidence in-situ process monitor sensor

2. 11961721 - Normal-incidence in-situ process monitor sensor

3. 11385154 - Apparatus and method for monitoring and measuring properties of polymers in solutions

4. 10978278 - Normal-incident in-situ process monitor sensor

5. 8831767 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

6. 8010222 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

7. 7332438 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

8. 7175503 - Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device

9. 7052369 - Methods and systems for detecting a presence of blobs on a specimen during a polishing process

10. 7030018 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

11. 6935922 - Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing

12. 6884146 - Systems and methods for characterizing a polishing process

13. 6866559 - Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad

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as of
12/6/2025
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