Taiwan Semiconductor Manufacturing Comp. Ltd.

Ching-Hai Yang

Yao-Hwan Kao

Shang-Sheng Li

Hsiang-Kai Tseng

Chuan-Wei Chen

Kuo-Pin Chen

Fei-Gwo Tsai

Kai-Yuan Cheng

Wei-Hsiang Tseng

Po-Chun Lee

Yung-Chang Lu

Jian-Yuan Lai

Li-Kong Tum

Steven Liu

Jing Chang

A method for manufacturing a semiconductor device includes forming a photoresist layer that includes a photoresist composition over a wafer to produce a photoresist-coated wafer. The photoresist layer is selectively exposed to actinic radiation to form a latent pattern in the photoresist layer. The latent pattern is developed by applying a developer to the selectively exposed photoresist layer under a first pressure gas flow setting in a development chamber. The photoresist layer is rinsed, under the first pressure gas flow setting, to form a patterned photoresist layer exposing a portion of the wafer in the development chamber. The patterned photoresist layer is spin dried under a second pressure gas flow setting. A pressure of the development chamber under the second pressure gas flow setting is greater than the pressure of the development chamber under the first pressure gas flow setting.

Method and system for manufacturing a semiconductor device

A method, comprising forming a material layer over a substrate; illuminating at least one region of the material layer with a light; recording strength of the light reflected from the at least one region; and determining a thickness of the material layer in the at least one region according to the strength of the light.

Semiconductor manufacturing apparatus and method thereof

A method for manufacturing a semiconductor device includes obtaining a first image of a fluid dispense nozzle using a first camera, the fluid dispense nozzle configured to dispense fluid on a semiconductor substrate, obtaining a second image of the fluid dispense nozzle using a second camera, the second image having a higher resolution than the first image, determining a width of the fluid dispense nozzle at multiple intervals along the fluid dispense nozzle and a width of a spray pattern of a fluid being dispensed from the fluid dispense nozzle at multiple intervals along the spray pattern, fitting a first straight line to a series of data points representing a plurality of widths of the intervals along the fluid dispense nozzle and a plurality of widths of the intervals along the spray pattern, determining a first slope of the first straight line, and determining a condition of the spray pattern and the fluid dispense nozzle based on the first slope.

Method and apparatus for coating photoresist over a substrate

A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

Spin dispenser module substrate surface protection system

Embodiments of a semiconductor processing apparatus are provided. The semiconductor processing apparatus includes a housing and a support base disposed in the housing. The semiconductor processing apparatus also includes a carrying arm movably disposed on the support base and a nozzle device disposed on the carrying arm. The semiconductor processing apparatus further includes a wafer plate disposed on the support base. When a cleaning process is performed, the carrying arm is moved toward the wafer plate, and the nozzle device emits a first gas toward the support base and the wafer plate.

Semiconductor processing apparatus and method of operating the same

A semiconductor apparatus is provided. The semiconductor apparatus includes a wafer chuck configured to hold a wafer, and a first nozzle configured to dispense first chemical liquid onto the wafer. The semiconductor apparatus also includes a second nozzle configured to dispense second chemical liquid onto the wafer at a first dispensing time after the first nozzle stops dispensing the first chemical liquid. The semiconductor apparatus also includes an image device configured to take images of the first nozzle and the second nozzle in sequence, and a processing module configured to analyze the images. The processing module adjusts the first dispensing time when a first defect image shows the first chemical liquid and the second chemical liquid existing in a space close to the first and the second nozzles and flowing to the wafer.

Semiconductor apparatus and adjustment method

A baking apparatus for baking a wafer is provided. The baking apparatus includes a wafer chuck configured to hold the wafer, and a heating device disposed over the wafer chuck and configured to heat the wafer. The baking apparatus also includes a carrying arm configured to transport the wafer over the wafer chuck. The wafer chuck is in physical contact with the center area of the bottom surface of the wafer when the wafer is held by the wafer chuck.

Baking apparatus and method

A lithography cluster includes at least two lithography cells having a first lithography cell and a second lithography cell, an interface unit configured to integrate with the first lithography cell and the second lithography cell. The first lithography cell includes a first track and a first exposing tool and a second lithography cell includes a second track and a second exposing tool. The interface station includes a first interface buffer configured to couple the first track, a second interface buffer configured to couple the second track, a conveyor configured to couple the first interface buffer and the second interface buffer, and a robot configure to move along the conveyor, where in the robot transfers a substrate between functions of multiple functions within the first lithography cell, the second lithography cell, or between the first lithography cell and the second lithography cell.

Method of optimizing lithography tools utilization

The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a lithography tool. The lithography tool includes: a first nozzle configured to dispense a developer solution to a wafer; a second nozzle configured to dispense a cleaning solution to the first nozzle; and a controller configured to operate the second nozzle according to a predefined program. The present disclosure also provides a method of fabricating a semiconductor device. The method includes performing a developing process, wherein the performing the developing process includes dispensing a developer solution on a wafer using a first nozzle. The method also includes cleaning the first nozzle with a second nozzle, wherein the cleaning the first nozzle is executed according to one of a plurality of program recipes that each specify a sequence and a duration for which the first nozzle and the second nozzle are to be selectively activated.

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Taipei, Taiwan

Ching-Hai Yang