Industrial Technology Research Institute

Applied Materials, Inc.

Ching-Chang Chen

Hsiu-Jen Wang

Shih-Hao Kuo

Chien-Hua Lai

Yi-Cheng Chen

Ming-Chieh Chou

Wei-Chung Chen

Chia-Hung Kao

Tsu-Hui Yang

Yi-Sheng Liu

Chao-Chang Hu

Yu-Jen Wang

Chia-Ching Lin

Sheng-Chih Shen

Han-Wei Su

Chien-Shien Yeh

Chi-Hung Lee

Tai-Feng Wu

Shih-Hsien Lee

Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Dynamic imaging system

Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.

Multi-substrate processing on digital lithography systems

Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.

Multi-configuration digital lithography system

An optical encoding device includes a light source module, an encoding disc, and a photodetector. The light source module emits a source beam. The encoding disc is disposed on a passing path of the source beam. The encoding disc has first diffracting patterns. The first diffracting patterns include a plurality of sets of first diffracting patterns arranged along a radial direction of the encoding disc. Each set of the first diffracting patterns includes a plurality kinds of first diffracting patterns having different pattern extending directions and different pattern periods. When the encoding disc is rotating, the first diffracting patterns in each set of first diffracting patterns enter the passing path of the source beam in sequence, to cause a diffraction and form diffracted beams having different angles. The photodetector receives the diffracted beams having the different angles.

Optical encoding device including an encoding disc having diffracting patterns

An optical encoder includes a light emitting module, a positioning device and a light separating structure. The light emitting module emits a light beam illuminating an illumination area of the positioning device. The positioning device includes light penetrating areas arranged in a dislocation manner. The light penetrating areas sequentially move into the illumination area. The light separating structure is disposed in the path of the light beam. The positioning device is disposed between the light emitting module and the light separating structure. When part of the light beam penetrates one of these light penetrating areas and is transmitted to the light separating structure, the light separating structure transmits the light to a sensing area and forms at least one first positioning optical pattern. The distance between two first positioning optical patterns formed by two adjacent light penetrating areas is greater than the pitch between the two adjacent light penetrating areas.

Optical encoder having a positioning device with light penetrating areas disposed between a light emitting module and a light separating structure

A mechanical encoder including an assembly, a flexible element, and a signal sensing module is disclosed. The assembly has a plurality of poking/stiring structure that provides poking/stirring function. The flexible element includes a first piezoelectric layer and a second piezoelectric layer. The first piezoelectric layer and the second piezoelectric layer are stacked on each other via an attach material. The flexible element is set up so that the poking/stiring structures stir/poke a first end of the flexible element, so as to output an electrical signal responsive to deformation of the flexible element. The signal sensing module receives the electrical signal to generate a position signal and a direction signal corresponding to the movement of the poking structures.

Mechanical encoder

A method for projection correction includes following steps. An original image is projected as a projection image on an object. A projection-zone image including the projection image is captured from the object. A projection image outline corresponding to the projection image is obtained from the projection-zone image. An operation is performed on the projection image outline to obtain a horizontal inclination and a vertical inclination. The original image is pre-warped according to the horizontal inclination and the vertical inclination to obtain a corrected image, and the corrected image is projected on the object.

System and method for projection correction by capturing projection image

The present invention provides a piezoelectrically driven optical lens module. The piezoelectrically driven optical lens module includes at least a lens body, a guiding rod for providing an axial movement track, a piezoelectric element for providing driving force, and an elastic element for providing the piezoelectric element with pre-load, so as to allow the piezoelectric element to be in contact with the guiding rod. The lens body includes at least an enclosed hollow structure, a lens barrel axially moveable and fixed to the enclosed hollow structure, and a lens element fixed to the lens barrel. The piezoelectric element is in contact with the guiding rod via the elastic elements, and the piezoelectric element is used for driving the lens barrel to move linearly along the guiding rod. The present invention provides a piezoelectrically driven optical lens module with a simple structure, to overcome the drawbacks of the prior art.

Growing community of inventors

Tainan, Taiwan

Ching-Chang Chen