Samsung Electro-Mechanics Co., Ltd.

Chin Mo Kim

Jae Yeong Kim

Sung Yong An

Sung Nam Cho

Ji Hyung Jung

Jin Woo Kim

Chang Hwa Park

Sungyong An

Min Gi Sin

Hak Kwan Kim

Juhyoung Park

Jong Ho Lee

Woo Sup Kim

Hong Seok Kim

Chi Hwa Lee

Daeki Lim

Byung Hyun Park

Ju Hyoung Park

Jung Wook Seo

Youngsik Hur

Won Cheol Lee

Hyung Jin Jeon

Jeongki Ryoo

Eun Hye Na

Hyunjun Choi

Jungil Kim

An antenna device according to embodiment includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed on the second dielectric layer; a first antenna including a first feed via passing through the first dielectric layer and a first antenna patch disposed in a first surface of the first dielectric layer; and a second antenna including a second feed via passing through the first dielectric layer and a second antenna patch disposed in the first surface of the first dielectric layer, wherein a dielectric constant of the second dielectric layer is lower than a dielectric constant of the first dielectric layer and a dielectric constant of the third dielectric layer, and the second dielectric layer has a cavity overlapping the second antenna patch.

Antenna device

An antenna includes a first insulating layer; a second insulating layer disposed on the first insulating layer in a height direction; a third insulating layer disposed between the first and second insulating layers, a feed via including a first portion passing through the first insulating layer, a second portion passing through the second insulating layer, and a third portion passing through the third insulating layer and connected to the first and second portions; and an antenna patch disposed on the first insulating layer and fed from the feed via, wherein a permittivity of the third insulating layer is lower than permittivities of the first and second insulating layers, and in a direction perpendicular to the height direction, a width of the third portion is wider than a width of the first portion and/or a width of the second portion.

Antenna

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

Dielectric composition and multilayer ceramic capacitor containing the same

A chip antenna includes a substrate having a concavo-convex pattern on a surface thereof, and a conductor pattern disposed on the surface of the substrate having the concavo-convex pattern, wherein a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern.

Chip antenna and manufacturing method thereof

An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Array antenna

A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

Chip antenna

A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an MgSiOphase, an MgAlOphase, and a CaTiOphase, and a content of the CaTiOphase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO) doped with a metal oxide, and the shell region is formed of a ferroelectric material.

Dielectric powder and multilayer capacitor using the same

An antenna device is provided. The antenna device includes an antenna body portion configured to transmit and/or receive a radio frequency (RF) signal, and including a dielectric material having a first dielectric constant; a metal layer configured to contact the antenna body portion; a first insulation layer configured to cover at least a part of the metal layer; and an electrical connection structure configured to be electrically connected to the metal layer, wherein the first dielectric constant of the antenna body portion is larger than a dielectric constant of the first insulation layer, and is smaller than a dielectric constant of the metal layer.

Antenna apparatus

A chip antenna includes: a dielectric material block including a plurality of sides including a first side, a second side, and a third side that are different from each other; a first antenna portion including a first conductor pattern disposed on the first side; a second antenna portion including a second conductor pattern disposed on the second side; and a third antenna portion including a third conductor pattern disposed on the third side. The first conductor pattern, the second conductor pattern, and the third conductor pattern are respectively isolated on the first side, the second side, and the third side, and are independently positioned.

An antenna device includes first and second dielectric layers. The first dielectric layer includes first and second sides facing each other in a third direction. The second dielectric layer includes third and fourth sides facing each other in the third direction. A first antenna patch is disposed on the first side of the first dielectric layer. A second antenna patch is disposed on the third side of the second dielectric layer. Signals with a first frequency bandwidth are transmitted or received electrical signals applied to the first antenna patch. Signals with a different second frequency bandwidth are transmitted or received by an electrical signal applied to the second antenna patch. A height of the second dielectric layer measured to the third side from the fourth side in a direction parallel to a third direction is greater than a height of the first dielectric layer measured to the first side from the second side.

A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.

Growing community of inventors

Suwon-si, South Korea

Chin Mo Kim